Rigid-Flex PCB Slit Lamination for Burr-Free Cutting
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Solution Overview
Problem
The existing methods for manufacturing rigid-flexible printed circuit boards often result in burrs on the flexible region and differing cutting precision between the rigid and flexible regions due to material property differences, affecting the quality of the final product.
Innovation Solution
A method involving the creation of slits in the flexible substrate along imaginary boundary lines, followed by lamination with a rigid substrate, removal of unwanted sections, and precise cutting along imaginary boundary lines to remove peripheral margins, ensuring accurate alignment and cutting precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the pre-cut region is removed simultaneously with a milling cutter, then the manufacturing process is simplified, but burrs are formed on the margin of the flexible region
Solution Approach 1:
The patent divides the substrate into distinct regions: a rigid region with a first property and a flexible region with a second property. By segmenting the substrate before removal, each region can be processed independently with appropriate parameters, preventing burr formation on the flexible region margin while maintaining ease of manufacture.
2Ease of manufacture
If the same cutting parameter is used for both rigid and flexible regions, then the cutting process is simplified, but the cutting precision differs between regions
Solution Approach 1:
The patent applies different cutting parameters to different regions of the substrate. The rigid region and flexible region are processed with region-specific cutting parameters that match their respective material properties, ensuring high cutting precision for both regions while maintaining process simplicity through automated parameter selection based on region identification.
Data Source
AI summary
A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.