Rigid-Flex Image Sensor Assembly for Easier Soldering and Testing
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Solution Overview
Problem
Flexible printed circuits (FPCs) used in vehicle applications require specially designed reflow solder pallets, increasing manufacturing costs, and incorporate zero-insertion connectors that complicate testing environments.
Innovation Solution
An image sensor assembly featuring a flexible substrate with one or more rigid layers and a rigid metallic structure, which eliminates the need for specialized solder pallets and allows for the use of surface-mounted board-to-board connectors and zero-insertion force interfaces, facilitating easier testing and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If specially designed reflow solder pallets are used for manufacturing FPCs, then manufacturing capability is improved, but manufacturing costs increase
Solution Approach 1:
The patent extracts the rigid support function from the specialized reflow solder pallet and transfers it to a rigid layer that is permanently integrated into the FPC structure. This eliminates the need for separate specialized manufacturing equipment while maintaining the required rigidity during soldering operations.
Solution Approach 2:
The rigid layer serves multiple functions: it provides structural rigidity during reflow soldering, acts as a permanent mechanical support for the FPC, and eliminates the need for specialized pallets. This multi-functionality reduces manufacturing complexity while maintaining capability.
2Adaptability or versatility
If zero-insertion connectors (ZIFs) are used in FPCs, then connection flexibility is improved, but testing difficulty increases
Solution Approach 1:
The patent introduces an intermediary testing point structure that mediates between the ZIF connector and the testing equipment. These testing points provide accessible electrical contact locations that facilitate testing while the ZIF connector maintains its flexibility advantage.
Solution Approach 2:
The FPC is segmented into functional zones: the ZIF connector area for flexible connection, separate testing point areas for easy measurement, and the rigid layer area for structural support. This segmentation allows each function to be optimized independently.
3Strength
If rigid layers are added to the FPC body portion, then structural support is improved, but flexibility is reduced
Solution Approach 1:
The rigid layer is applied locally only to the body portion of the FPC where structural support is needed for mounting components and maintaining rigidity during soldering. The elongated portion and outer portions remain flexible, achieving local optimization of both rigidity and flexibility.
Solution Approach 2:
The FPC employs a composite structure combining a flexible substrate base material with an added rigid layer (such as FR-4 or other rigid materials). This composite construction allows the overall structure to exhibit both the flexibility of the base material and the rigidity of the overlaying layer where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs by eliminating the need for specialized solder pallets and simplifies testing through the use of standard connectors, while the rigid metallic structure enhances thermal management and component protection.
Implementation Method 1
The rigid metallic structure enhances thermal management
Data Source
AI summary
An image sensor assembly is disclosed herein that can include a flexible substrate having a top surface and a bottom surface. The flexible substrate includes a body portion, an outer portion, and an elongated portion that extends from the body portion. The image sensor assembly also includes at least one rigid layer disposed over at least one of the top surface or the bottom surface of the body portion of the flexible substrate. The image sensor assembly also includes a rigid metallic structure disposed on the bottom surface of the body portion.