Rigid-Flex Support Assembly Without Adhesives for Thermal Stability
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Solution Overview
Problem
Existing carrier assembly manufacturing processes are limited by geometric design versatility, require large areas for contacting, and suffer from temperature stability issues due to adhesive use, particularly in rigid-flex composite technologies.
Innovation Solution
A manufacturing method involving partial or complete detachment of a flexible layer from a carrier using mechanical, chemical, or electromagnetic means, allowing for the creation of rigid-flexible systems with enhanced temperature resistance and chemical stability, enabling compact and versatile designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If adhesive layers are used to bond the flexible layer to the carrier, then the carrier assembly achieves structural stability, but temperature stability is compromised due to adhesive limitations
Solution Approach 1:
The patent removes the adhesive layer from the system by detaching the flexible layer from the carrier, eliminating the temperature stability limitation that adhesives impose while maintaining structural integrity through the detached configuration
Solution Approach 2:
The patent segments the carrier assembly into a detached flexible layer and carrier, creating distinct regions that can independently withstand temperature variations without being constrained by adhesive bonding limitations
2Reliability
If conventional rigid-flex composite technology is used, then conductive connections are achieved, but the design is limited to larger conductive line widths of at least 50 μm
Solution Approach 1:
The patent employs a flexible layer that can be detached from the carrier, enabling the creation of fine conductive structures without the geometric constraints of conventional rigid-flex composite technology, thus achieving smaller conductive line widths while maintaining connection reliability
3Ease of operation
If the flexible layer is completely detached from the carrier, then maximum flexibility and compactness are achieved, but structural stability is reduced
Solution Approach 1:
The patent applies partial detachment of the flexible layer from the carrier, achieving sufficient flexibility and compactness for the application while maintaining enough structural stability through the partial attachment, avoiding complete detachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of carrier assemblies with improved flexibility, compactness, and stability, facilitating efficient signal transmission and component integration without adhesives, thus enhancing temperature resistance and chemical stability.
Implementation Method 1
completely or at least partially detaching or exposing the at least one second region of the at least one layer from the at least one carrier
Implementation Method 2
completely or at least partially detaching or exposing the at least one second region of the at least one layer from the at least one carrier
Implementation Method 3
completely or at least partially detaching or exposing the at least one second region of the at least one layer from the at least one carrier
Data Source
Figure 1A~2B
Figure 3A~4B
Figure 5A~6B
AI summary
The invention relates to a support assembly (100; 500; 600; 700; 800; 900; 000) and to a method for producing a support assembly. The method has the steps of: - producing a layer (130; 530; 630; 730; 830; 930; 1030) on one surface (120; 520; 620; 720; 820; 920; 1020) of a support (110; 510; 610; 710; 810; 910; 1010), said layer comprising a first region (131; 531; 631; 731; 831; 931; 1031) and a second region connected to the first region (132; 532; 632; 732; 832; 932; 1032), wherein the first region covers a first surface region (121; 521; 621; 721; 821; 921; 1021) of the support, and the second region covers a second surface region (122; 722; 922) of the support, and - removing the second region of the layer from the support. The first region of the layer remains on the first surface region of the support and is not separated from the second region, and the layer is flexible in the removed second region.