Rigid-Flex Wireless Module with Integrated Antenna
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Solution Overview
Problem
Conventional wireless module designs face challenges in size optimization and high-frequency loss due to separate mounting of communication IC and antenna, leading to increased costs and complexity, while existing solutions with rigid-flex technology introduce noise and circuit complexity.
Innovation Solution
A wireless module with an integrated antenna using a rigid-flex board, where the antenna is directly connected to a flex substrate's signal and ground layers, and a communication unit is integrated on a stacked rigid substrate, simplifying signal transmission and reducing costs through continuous layer arrangement and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If communication IC and antenna are mounted separately with RF connector and cable, then antenna optimization is facilitated, but high-frequency loss increases and component costs increase significantly
Solution Approach 1:
The patent divides the circuit board into rigid and flex substrate portions, with the antenna mounted on the flex substrate and the communication IC on the rigid substrate. This segmentation allows the antenna to be optimized for performance while maintaining a compact integrated structure, eliminating the need for separate RF connectors and cables that cause high-frequency loss.
Solution Approach 2:
The flex substrate acts as an intermediary between the antenna and the rigid substrate, providing a low-loss transmission path for RF signals. This intermediary structure replaces traditional RF connectors and cables, reducing impedance discontinuities and minimizing high-frequency signal loss while still allowing antenna optimization.
2Loss of energy
If pin connector is used to substitute RF connector and cable, then high-frequency loss is reduced, but impedance matching problem increases design difficulty
Solution Approach 1:
The patent merges the connector function into the rigid-substrate connection structure itself, where the rigid substrate directly connects to the flex substrate without requiring separate pin connectors. This integration simplifies the impedance matching design by eliminating additional connector interfaces while maintaining low high-frequency loss through the continuous transmission path.
3Adaptability or versatility
If power layer and ground layer are interruptedly mounted in rigid PC board and flex PC board, then antenna and communication IC can be separated, but circuit complexity increases and unnecessary noises are introduced
Solution Approach 1:
The patent ensures continuous power and ground layers across the rigid-flex board structure, maintaining uninterrupted reference planes and power delivery. This continuity reduces circuit complexity by eliminating the need for complex via structures and trace rerouting, while also minimizing noise by preventing ground loops and impedance discontinuities, thus allowing component separation without sacrificing signal integrity.
Data Source
AI summary
A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate. It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size.