Rigid-Flexible Printed Circuit Board Without Separate Connectors

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Solution Overview

Problem

Flexible printed circuit boards in electronic devices with multiple structures face challenges in maintaining flexibility and durability due to increased signal wires, leading to issues with folding and unfolding, and the need for connectors that hinder compactness.

Innovation Solution

A printed circuit board with a rigid region and a flexible region, where the flexible region extends from the rigid region, allowing for enhanced flexibility and durability, and includes a conductive pad and circuit pattern to facilitate electrical connections without separate connectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a connector is disposed to connect flexible printed circuit board and rigid circuit board, then electrical connection is achieved, but compactness is hindered

Engineering Contradiction:
Improveelectrical connectionVSAvoidcompactness
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the flexible printed circuit board and rigid circuit board by directly forming circuit patterns on the flexible board that extend into the rigid board structure, eliminating the need for separate connectors. The circuit pattern acts as both the flexible connection medium and the connector interface simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the connector function from the flexible printed circuit board design by integrating it directly into the circuit pattern layout. The circuit pattern itself serves the connector function, removing the need for additional connector components.

Inventive Principle:
Principle #2Taking out (Extraction)

2Adaptability or versatility

If more signal wires are disposed on flexible printed circuit board to accommodate higher performance components, then functional capability is improved, but flexibility is degraded

Engineering Contradiction:
Improvefunctional capabilityVSAvoidflexibility
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The patent applies different structural characteristics to different regions of the flexible printed circuit board. The signal wire regions maintain flexibility with appropriate trace routing, while connection regions provide structural stability through direct rigid board integration. This localized differentiation allows high signal wire density without compromising overall flexibility.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent creates a dynamic structure where the flexible printed circuit board can deform in specific zones while maintaining electrical connectivity. The circuit patterns are designed to accommodate deformation through proper trace geometry and routing, allowing the board to flex where needed while maintaining signal integrity.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If flexible printed circuit board is deformed repeatedly for folding/unfolding operations, then adaptability to multiple structures is improved, but durability is degraded

Engineering Contradiction:
Improveadaptability to multiple structuresVSAvoiddurability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent incorporates reinforcement structures and protective layers in the flexible printed circuit board design before deformation occurs. These pre-built protective features cushion the board against damage during repeated folding and unfolding operations, maintaining durability while enabling adaptability to multiple structural configurations.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent uses composite material structures in the flexible printed circuit board, combining flexible substrate materials with reinforcement layers and protective coatings. This composite construction provides both the flexibility needed for repeated deformation and the durability to withstand fatigue from folding/unfolding operations.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12414230B2Printed circuit board, fabrication method of the same and electronic device including the same
Publication Date: 2025.09.09 SAMSUNG ELECTRONICS CO LTD
  • US12414230B2 patent drawing
  • US12414230B2 patent drawing
  • US12414230B2 patent drawing

AI summary

A printed circuit board and/or an electronic device including the same are provided. The printed circuit board and/or an electronic device includes at least one insulation layer including a first rigid region and a flexible region extending from the first rigid region, at least one first circuit pattern disposed on one surface of the at least one insulation layer to at least partially transverse the flexible region from the first rigid region, and at least one conductive pad formed at least partially on a surface of the first circuit pattern in the first rigid region, wherein the flexible region may be configured to flexibly deform more than the first rigid region.