Rigid-Flexible PCB with Embedded Substrates for Compact Design

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Solution Overview

Problem

Conventional printed circuit boards (PCBs) lack flexibility and structural integration, making them unsuitable for applications requiring both rigidity and flexibility, such as in compact electronic devices where circuit boards need to be bent or moved.

Innovation Solution

A printed circuit board with a novel structure comprising a flexible substrate divided into regions with embedded first and second rigid substrates, allowing for reduced thickness and size, and simplifying the manufacturing process by forming a cavity for electronic devices, enabling mass production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conventional rigid PCB is used, then structural strength is maintained, but flexibility and adaptability are lost

Engineering Contradiction:

ImproveflexibilityVSAvoidstructural strength

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The PCB is divided into distinct rigid regions and flexible regions. The flexible substrate is segmented into first, second, and third regions, with rigid substrates positioned in specific areas to provide structural support where needed while maintaining flexibility in other areas.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the PCB are assigned different mechanical properties. The flexible substrate provides flexibility in certain areas, while rigid substrates are embedded in specific regions to provide structural strength, creating a non-uniform distribution of mechanical properties throughout the board.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If multiple separate components are used to achieve rigid-flexible functionality, then functional requirements are met, but device complexity increases

Engineering Contradiction:

Improverigid-flexible functionalityVSAvoidstructural integration

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The rigid and flexible substrates are integrated into a single unified structure. The rigid substrates are embedded within the flexible substrate to form an integrated rigid-flexible PCB, eliminating the need for separate components and reducing overall structural complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The rigid substrates are nested within the flexible substrate, with the flexible substrate forming an outer layer that contains and supports the embedded rigid substrates, creating a compact integrated structure.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Productivity

If traditional manufacturing processes are used, then manufacturing precision is maintained, but productivity is reduced due to complex assembly steps

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidmanufacturing process complexity

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The rigid and flexible substrates are prepared and positioned in advance during the manufacturing process, with alignment marks and guide structures pre-configured to facilitate precise registration and assembly, streamlining the overall manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9320137B2Printed circuit board and method for manufacturing the same

Publication Date: 2016.04.19 LG INNOTEK CO LTD

AI summary

Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.