Rigid-Flexible Substrate for 3DIC Interconnection Warpage
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Solution Overview
Problem
The semiconductor industry faces challenges in miniaturization and packaging of semiconductor devices due to limitations in interconnection density and area constraints, particularly with stacked semiconductor devices like 3DICs, where uneven wafer warpage and high-pin-density connectors pose issues.
Innovation Solution
The use of rigid/flexible substrates with high-speed connectors and sockets allows for high-bandwidth interconnections between integrated circuit packages, overcoming area constraints and accommodating wafer warpage by providing flexible interconnections and enabling high-pin-density connectors for applications like data centers and AI servers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If stacked semiconductor devices (3DICs) are used to reduce physical size, then integration density is improved, but uneven wafer warpage and interconnection reliability deteriorate
Solution Approach 1:
The patent introduces an interposer substrate as an intermediary component between stacked semiconductor dies. This interposer provides a stable platform with controlled impedance traces and redistribution layers that mediate the interconnections between dies, isolating them from warpage effects and improving overall interconnection reliability while maintaining high integration density.
Solution Approach 2:
The patent employs underfill material with specific rheological parameters and curing characteristics to compensate for wafer warpage. By controlling the viscosity, flow characteristics, and thermal expansion parameters of the underfill, the system accommodates dimensional changes during processing and operation, maintaining reliable interconnections in stacked devices.
2Power
If high-pin-density connectors are used to increase interconnection bandwidth, then data transmission capacity is improved, but manufacturing complexity and area constraints worsen
Solution Approach 1:
The patent transitions from planar interconnection layouts to three-dimensional stacked architectures with vertical interconnections through TSVs (through-silicon vias) and bump bonds. This dimensional change allows high-pin-density connectors to achieve greater bandwidth by utilizing the vertical dimension, effectively multiplying the interconnection capacity without increasing the footprint area.
Solution Approach 2:
The interposer substrate serves multiple functions simultaneously: it provides mechanical support, enables impedance control for high-speed signals, facilitates bump bond formation, and allows redistribution of interconnection patterns. This multi-functionality consolidates what would otherwise require separate components, reducing overall manufacturing complexity despite the high pin density requirements.
3Quantity of substance
If minimum feature size is reduced to increase integration density, then component capacity is improved, but manufacturing precision requirements worsen
Solution Approach 1:
The patent segments the manufacturing process into distinct modules: wafer-level processing for die fabrication, separate underfill application and curing steps, individual bump bond formation processes, and staged encapsulation. This segmentation allows each step to be optimized independently, maintaining manufacturing precision even as minimum feature sizes decrease to increase integration density.
Data Source
AI summary
A device includes a package. The package includes a plurality of dies, an encapsulant encapsulating the plurality of dies, and a redistribution structure over the plurality of dies and the encapsulant. The device further includes first sockets bonded to a top surface of the redistribution structure and a rigid/flexible substrate bonded to the top surface of the redistribution structure. The rigid/flexible substrate includes a first rigid portion, a second rigid portion, and a flexible portion interposed between the first rigid portion and the second rigid portion. The device further includes second sockets bonded to the first rigid portion of the rigid/flexible substrate and connector modules bonded to the second rigid portion of the rigid/flexible substrate.