Rigid-Flexible Substrate for MLP Package Size Reduction
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Solution Overview
Problem
The increasing number of bumps and solder balls in molded laser packages (MLPs) for package-on-package structures leads to larger package sizes, necessitating a reduction in the number of solder balls and bumps while maintaining signal transmission paths.
Innovation Solution
A package structure incorporating a rigid-flexible substrate with both rigid and flexible regions, where the rigid region is connected to the package and the flexible region extends outside, allowing for reduced solder balls and bumps, and enabling signal transmission between packages without a mainboard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of bumps and solder balls is increased to support more interconnections in package-on-package structures, then the signal transmission capability is improved, but the package size increases
Solution Approach 1:
The patent introduces a rigid-flexible substrate that extends in multiple dimensions, with rigid portions connecting to packages and flexible portions extending outward. This dimensional extension allows signal transmission paths to route through alternative spaces without requiring additional vertical stacking or horizontal expansion of the core package structure, thereby maintaining compact size while supporting increased interconnection density.
Solution Approach 2:
The rigid-flexible substrate acts as an intermediary element between packages, providing extended signal transmission paths that route through the flexible region. This mediator approach allows signals to travel between packages without requiring direct solder ball connections, reducing the number of solder balls needed while maintaining signal transmission capability.
2Volume of moving object
If the number of solder balls is reduced to decrease package size, then the package size is reduced, but the signal transmission path between packages is compromised
Solution Approach 1:
The flexible portion of the rigid-flexible substrate creates alternative signal transmission dimensions by extending beyond the package boundaries. This allows signals to route through the flexible region and connect to other packages, providing redundant transmission paths that maintain reliability even when the number of traditional solder ball connections is reduced.
Solution Approach 2:
The patent changes the physical state and configuration of the substrate by introducing flexible portions with different mechanical and electrical properties compared to rigid portions. This parameter change allows the substrate to serve dual functions: providing structural support through rigid regions and enabling extended signal transmission through flexible regions, thereby maintaining signal reliability with fewer solder balls.
Data Source
AI summary
A package structure includes a first package including a first substrate and a first molded portion disposed on the first substrate; and a rigid-flexible substrate disposed on at least a portion of the first package and having a rigid region and a flexible region. The first molded portion is disposed between the first substrate and the rigid-flexible substrate.