Rigid-Flexible Voltage Reference Card for Thermal Gradient Control

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Solution Overview

Problem

Voltage reference circuits are sensitive to external environmental factors such as temperature changes, humidity, mechanical stress, and vibrations, leading to inaccuracies in their output, especially in field environments where conditions vary significantly from controlled settings.

Innovation Solution

A double-sided circuit board arrangement with a rigid ceramic base material, incorporating a voltage reference circuit on one side and a temperature sensor on the opposite side, connected by flexible circuit boards, which mitigates thermal gradients and mechanical stress, ensuring accurate voltage reference output despite environmental variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a rigid circuit board is used for voltage reference circuit, then mechanical stability is improved, but thermal gradient sensitivity increases

Engineering Contradiction:
Improvemechanical stabilityVSAvoidthermal gradient sensitivity
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The circuit board is divided into multiple rigid sections connected by flexible interconnections. This segmentation allows each rigid section to maintain mechanical stability while the flexible connections accommodate thermal expansion and contraction, reducing thermal gradient sensitivity across the entire board.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the physical parameters of the circuit board by incorporating materials with specific thermal expansion coefficients and designing the board geometry to minimize thermal stress. This allows the board to maintain rigidity while being less sensitive to thermal gradients.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If flexible circuit board is used to connect components, then thermal stress resistance is improved, but mechanical precision deteriorates

Engineering Contradiction:
Improvethermal stress resistanceVSAvoidmechanical precision
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The flexible connections are designed as segmented structures with controlled flexibility zones. This allows the board to bend and accommodate thermal stress while maintaining precise mechanical alignment and positioning of critical components in the rigid sections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the circuit board have different mechanical properties - rigid sections for precision components and flexible sections for stress accommodation. This local differentiation allows simultaneous achievement of mechanical precision and thermal stress resistance in appropriate areas.

Inventive Principle:
Principle #3Local quality

3Measurement precision

If temperature compensation circuit is added, then voltage reference accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvevoltage reference accuracyVSAvoidcircuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature compensation functionality is merged with the existing voltage reference circuit by using the same physical platform and sharing components. This integration approach provides temperature compensation while minimizing the increase in overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit board structure itself provides temperature compensation through its physical design - the rigid-flexible-rigid configuration naturally compensates for thermal effects, eliminating the need for complex active compensation circuits while maintaining voltage reference accuracy.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution maintains accurate voltage reference values by minimizing thermal gradients and mechanical strain, allowing the circuit to function reliably in challenging environmental conditions without excessive energy consumption or practical limitations.

Implementation Method 1

the rigid circuit board comprises a ceramic material or a mixture of ceramic materials... There do not exist any notable temperature gradients in the area of the voltage reference circuit

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first flexible circuit board and a second flexible circuit board connected to opposite edges of the rigid circuit board... mitigates thermal gradients and mechanical stress

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12453010B2Inflexible voltage reference circuit card, and method for manufacturing an inflexible voltage reference circuit card
Publication Date: 2025.10.21 BEAMEX
  • US12453010B2 patent drawing
  • US12453010B2 patent drawing

AI summary

Voltage reference circuits may be sensitive to thermal changes in their surroundings and to effects made by humidity, and external forces, vibrations, and other effects. A rigid planar circuit structure has a voltage reference circuit on either side and a temperature sensor on another side of the rigid circuit board. The arrangement includes two flexible connectors, such as flexible circuit boards or flexible flat cables. These can be relatively short in their length. Ceramic materials can be used as a base material in the rigid circuit board, such as alumina. The arrangement enables obtaining accurate outputs from the voltage reference circuit because notable thermal gradients will not be present around sensitive parts of the circuitry.