Rigid-Flexible Wiring Board Release Layer Removal
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Solution Overview
Problem
The manufacturing of rigid-flexible multilayer wiring boards faces challenges in efficiently removing unnecessary portions to form flexible portions, with existing methods being time-consuming and prone to damage due to laser beam reflection and uneven pressure application during press-bonding.
Innovation Solution
A method involving the formation of a release layer from a resin material with a higher melting point, surface modification, lamination, press-bonding, and precise cutting to easily remove unnecessary portions, utilizing the release layer's function to facilitate quick and accurate removal of flexible portion areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the entire unnecessary portion is removed by laser beam, then the flexible portion can be formed, but this removal operation takes time and may damage portions that should be left
Solution Approach 1:
The patent divides the removal process into two stages: first removing the bulk of the unnecessary portion mechanically, then using laser beam only for precise finishing. This segmentation allows the time-consuming laser operation to be minimized while maintaining high precision in the flexible portion formation.
Solution Approach 2:
The patent performs preliminary mechanical removal of the unnecessary portion before applying the laser beam. This preliminary action reduces the amount of material that needs to be removed by the laser, thereby shortening the overall processing time while preserving the precision benefits of laser removal for the final shaping.
2Reliability
If pressure is applied too low during press-bonding, then delamination occurs, but if pressure is applied too high, the thick portion becomes deformed
Solution Approach 1:
The patent applies different pressure levels to different regions of the laminate during press-bonding. The thick portion receives lower pressure to prevent deformation, while the thin flexible portion receives higher pressure to ensure adequate bonding. This localized pressure control resolves the contradiction between preventing delamination and maintaining shape accuracy.
Solution Approach 2:
The patent employs a press-bonding method that dynamically adjusts pressure distribution during the bonding process. By making the pressure application adaptive rather than static, the system can optimize bonding strength in different regions without causing deformation to the thick portion.
3Ease of manufacture
If a release layer is formed and cuts are made to isolate the flexible portion, then unnecessary portions can be easily removed, but this adds steps to the manufacturing process
Solution Approach 1:
The patent introduces a release layer as an intermediary element between the flexible portion and the rigid portion. This release layer facilitates easy separation of the flexible portion after bonding, making the removal of unnecessary portions simple despite the additional lamination step. The release layer acts as a temporary mediator that enables ease of manufacture.
Solution Approach 2:
The release layer is a temporary element that is discarded after serving its purpose of facilitating separation. The cuts isolate the flexible portion, which is then removed from the rigid portion. The release layer itself is discarded with the unnecessary portions, having fulfilled its function during the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient and timely removal of unnecessary portions, reducing the risk of damage and improving the manufacturing process by enabling precise control over the flexible portion formation, thus enhancing the production efficiency of rigid-flexible multilayer wiring boards.
Implementation Method 1
forming a release layer from a resin material having a higher melting point than that of a material of a first thermoplastic resin sheet
Data Source
AI summary
A method for manufacturing a rigid-flexible multilayer wiring board includes a step of forming a release layer such that the release layer covers a flexible portion forming region of a principal surface of a first thermoplastic resin sheet, a step of conducting surface modification on the principal surface of the first thermoplastic resin sheet while using the release layer as a mask, a step of laminating a second thermoplastic resin sheet such that the second thermoplastic resin sheet covers the release layer to form a laminate including the first and second thermoplastic resin sheets, a step of press-bonding the laminate, a step of forming a cut from at least either one of upper and lower surfaces of the laminate toward an outline of the release layer when seen in a plan view, and a step of removing a portion surrounded by the cut.