Rigid Pin Sensor for Windscreen Temperature Measurement
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Solution Overview
Problem
Existing sensor arrangements for measuring the temperature of a pane, such as a windscreen, often rely on flexible printed circuit boards which complicate design and increase manufacturing costs, and do not efficiently achieve thermal contact.
Innovation Solution
A sensor arrangement featuring a rigid pin that serves both as an electrical and thermal connection to the pane, integrated within a housing with a thermal guide plate for enhanced thermal conductivity, allowing direct or indirect thermal contact, and potentially including additional sensors for moisture and internal temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a flexible printed circuit board is used to guide the temperature sensor to the pane, then the sensor can be positioned on the pane surface, but the design becomes more complex and manufacturing costs increase
Solution Approach 1:
The patent extracts the thermal conduction function from the flexible printed circuit board by introducing a separate rigid pin specifically designed for thermal contact with the pane. This separates the electrical connection function (handled by the flexible PCB) from the thermal measurement function (handled by the rigid pin), thereby reducing overall design complexity while maintaining measurement precision
Solution Approach 2:
The sensor arrangement is segmented into distinct functional components: the flexible printed circuit board for electrical connections and the rigid pin for thermal contact. This segmentation allows each component to be optimized for its specific function, reducing the complexity that would arise from using a single flexible PCB for both electrical and thermal purposes
2Measurement precision
If a flexible printed circuit board is used for sensor arrangement, then the temperature sensor can be positioned on the pane, but manufacturing costs increase
Solution Approach 1:
The thermal conduction function is extracted from the expensive flexible printed circuit board and assigned to a simpler, more cost-effective rigid pin. This allows the flexible PCB to be minimized to only the electrical connection function, reducing overall manufacturing costs while maintaining temperature measurement precision
Solution Approach 2:
The rigid pin serves as a simple, inexpensive thermal conduction element that can be easily manufactured and replaced if necessary. Its straightforward geometry and material requirements make it significantly cheaper than using a flexible PCB for thermal contact
3Measurement precision
If a flexible printed circuit board is used for thermal contact, then the sensor can contact the pane, but thermal conduction efficiency is reduced
Solution Approach 1:
The thermal conduction function is extracted from the flexible PCB and assigned to a dedicated rigid pin with optimized thermal properties. The rigid pin provides superior thermal contact with the pane, ensuring efficient heat transfer to the temperature sensor while the flexible PCB handles only electrical connections
Solution Approach 2:
The sensor arrangement uses a composite structure combining the flexible PCB material (for electrical flexibility) with the rigid pin material (for thermal conductivity). This composite approach leverages the strengths of different materials to achieve both electrical connection and efficient thermal conduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the design, reduces manufacturing costs, and enables rapid and precise temperature recording with minimal static/thermal measurement error, while allowing for the calculation of dew point and misting tendency on the windscreen.
Implementation Method 1
a heat-conducting element are guided out of the housing... the rigid pin is provided and configured to make a thermal contact with the pane
Data Source
AI summary
In a sensor arrangement for measurement of the temperature of a disk, it is provided that the sensor arrangement comprises a circuit carrier with a temperature sensor arranged thereon, wherein the circuit carrier and the temperature sensor are arranged in a housing and an electrical connection and a heat-conducting element are guided out from the housing, the heat-conducting element is configured as a rigid pin, the rigid pin has a thermal connection and a mechanical connection to the circuit carrier, the rigid pin is provided and configured to make a thermal contact with the disk.