Rigid Support Members for Semiconductor Die Thinning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Reducing the thickness of semiconductor wafers to miniaturize packaged dies leads to manufacturing defects such as chipping and damage to photo-sensing devices due to increased susceptibility to cracks and infrared radiation during lithography processes.
Innovation Solution
Incorporating a substantially rigid support member with sufficient mechanical strength, attached to the semiconductor die and substrate, to reinforce the wafer during thinning and singulation, and improve heat dissipation and thermal cycling robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the wafer is reduced to miniaturize packaged dies, then the size of packaged dies is reduced, but the backside of the wafer is more likely to chip during singulation and cracks can more readily propagate
Solution Approach 1:
The patent applies composite materials by combining the semiconductor wafer with a support structure that has different mechanical properties. The support structure is attached to the backside of the thinned wafer, creating a composite structure where the support material compensates for the reduced thickness and provides enhanced mechanical strength and crack propagation resistance during singulation processes.
Solution Approach 2:
The support structure acts as an intermediary element between the thinned wafer and the external environment during handling and singulation. This intermediary structure provides the necessary mechanical support to prevent chipping and crack propagation that would otherwise occur in the thinned wafer, enabling safe processing while maintaining miniaturization benefits.
2Volume of moving object
If the thickness of the wafer is reduced, then the size of packaged dies is reduced, but infrared radiation used during lithography processes can potentially damage photo-sensing devices
Solution Approach 1:
The patent converts the harmful effect of infrared radiation into a beneficial filtering mechanism. By incorporating a support structure with appropriate optical properties, the system blocks harmful infrared radiation from reaching photo-sensing devices during lithography, while allowing necessary processing wavelengths to pass through. This transforms the thinned wafer's increased vulnerability to radiation damage into an opportunity for selective radiation filtering.
3Strength
If a support member is added to reinforce the wafer, then mechanical strength and durability are improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the packaged component into distinct functional segments: the semiconductor die, the support structure, and the encapsulant. This segmentation allows each component to be optimized independently for its specific function while maintaining overall structural integrity. The support structure is designed as a separate element that can be attached to the die, providing reinforcement without requiring complete redesign of the entire package architecture.
Solution Approach 2:
The support structure is designed to perform multiple functions simultaneously: providing mechanical reinforcement during handling and singulation, blocking harmful infrared radiation, and serving as a mounting substrate for the semiconductor die. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving multiple protective and structural goals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support member reduces chipping and warping during singulation, enhances durability against thermal stresses, and improves heat dissipation, leading to more reliable and robust packaged semiconductor components.
Implementation Method 1
improves heat dissipation
Data Source
AI summary
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.