Rigid Tile-in-Polymer Panel for High-Density Interconnect Scaling
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Solution Overview
Problem
Current electronic manufacturing approaches, such as those using organic laminates, silicon or glass interposers, face limitations in wiring density, interconnect scaling, handling challenges, and high costs, making them unsuitable for future electronics manufacturing needs.
Innovation Solution
The use of a rigid tile-in-polymer film panel, where rigid tiles made of materials like silicon, glass, or ceramic ribbons are molded with a thin polymer composite, allowing for precise lithographic features down to sub-micron dimensions and enabling integration of active and passive components in pre-formed cavities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic laminates are used for substrate, then ease of manufacture is improved, but wiring density and interconnect scaling are limited
Solution Approach 1:
The patent employs a composite substrate structure combining organic laminate with embedded rigid tiles (silicon, glass, or ceramic). The rigid tiles provide high-density interconnect pathways with precise lithographic features, while the organic laminate provides ease of manufacture and flexibility. This composite approach resolves the contradiction by integrating materials with complementary properties.
Solution Approach 2:
The substrate is segmented into multiple rigid tiles that are embedded within the organic laminate. Each rigid tile can be independently patterned with high-density interconnects using precise lithography, while the overall substrate maintains manufacturability through modular assembly. This segmentation allows different regions to have different functional characteristics.
2Manufacturing precision
If glass panels are used for substrate, then manufacturing precision is improved, but handling challenges and high cost increase
Solution Approach 1:
The glass substrate is divided into smaller rigid tiles that are embedded into the organic laminate. These smaller tiles are easier to handle and process than large glass panels, reducing handling challenges while maintaining the manufacturing precision benefits of glass for the critical interconnect regions.
Solution Approach 2:
The patent creates a composite structure where rigid glass tiles are embedded in a flexible organic laminate matrix. This combination provides the manufacturing precision of glass where needed, while the organic laminate provides handling ease and flexibility for the overall substrate assembly.
3Manufacturing precision
If silicon interposers are used for substrate, then manufacturing precision is improved, but cost scalability is limited
Solution Approach 1:
Instead of using silicon interposers throughout the entire substrate, the patent applies rigid tiles (which can be silicon, glass, or ceramic) only in specific localized regions where high-density interconnects are required. This local application of precision materials reduces overall cost while maintaining manufacturing precision where it is most needed.
Solution Approach 2:
The patent uses a composite approach combining organic laminate with embedded rigid tiles made of silicon, glass, or ceramic depending on the specific application requirements. This allows cost-effective manufacturing by selecting materials based on functional needs rather than using expensive silicon interposers universally.
4Manufacturing precision
If rigid tiles are embedded in polymer film, then wiring density is improved, but device complexity increases
Solution Approach 1:
The substrate is segmented into modular rigid tiles that can be independently fabricated and then embedded into the polymer film. This modular approach simplifies the overall manufacturing process by breaking down the complex task of creating high-density interconnects across the entire substrate into manageable tile units that can be processed separately and assembled systematically.
Data Source
AI summary
Systems and methods are provided for electronic manufacturing, including use of a rigid tile-in-polymer film panel. Rigid tiles can be molded with a thin polymer composite to form the rigid tile-in-polymer film panel. The rigid panel can be made of silicon, glass, ceramic ribbon, or traditional glass fiber-reinforced laminates depending on the target product segment.