Rigid Wireway for LED Module Wiring Sealing

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Solution Overview

Problem

Multi-LED light fixtures face challenges in securing and sealing the complex wiring within a water-tight enclosure due to the large number of wires and heat dissipation, which complicates protecting the connections from environmental elements.

Innovation Solution

An LED light fixture design featuring a housing with a water-tight aperture and an integral rigid wireway that connects securely to the LED module, utilizing a sponge gasket layer for sealing and a metal wireway for secure wiring, creating a continuous sealed environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a water-tight enclosure is used to protect electronic elements, then protection from environmental elements is improved, but wiring organization and sealing engagement become problematic due to the large number of wires

Engineering Contradiction:
Improveprotection from environmental elementsVSAvoidwiring organization and sealing engagement
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent divides the wiring system into organized bundles or groups, with each bundle containing specific wires that are routed together through the housing. This segmentation makes it easier to manage and seal the wiring while maintaining water-tight protection, as seals can be applied to bundled wires rather than individual wires scattered throughout the enclosure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces intermediary components such as grommets, wire conduits, or sealing channels that facilitate the passage of multiple wires through the water-tight housing. These intermediary elements provide structured pathways for wiring while maintaining the seal integrity, reducing the complexity of both wiring organization and sealing engagement.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If LED modules are enclosed to protect wiring, then protection from environmental elements is improved, but heat dissipation becomes problematic

Engineering Contradiction:
Improveprotection from environmental elementsVSAvoidheat dissipation
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent applies different qualities to different regions of the enclosure: areas requiring thermal management are designed with heat-dissipating features such as fins, vents, or thermally conductive materials, while other areas maintain water-tight sealing. This local differentiation allows simultaneous achievement of protection and heat dissipation by optimizing each region for its specific function.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs nested structures where LED modules are mounted on heat sinks that are themselves enclosed within the housing. The heat sink acts as an intermediate thermal management component between the LED modules and the external environment, allowing heat to be dissipated through controlled pathways while maintaining overall water-tight protection of the wiring and electronic elements.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If a secure wiring arrangement is implemented, then reliability of connections is improved, but device complexity increases due to the large number of LEDs and wires

Engineering Contradiction:
Improvesecure connection between LED module and housingVSAvoidnumber of wires and connections
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple wiring functions into integrated components. For example, wiring channels are designed to simultaneously provide mechanical support, electrical insulation, and sealing functions. Connection terminals are designed to accommodate multiple wires in a single secure mounting point, reducing the number of separate connection points and simplifying the overall wiring arrangement while maintaining reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs universal wiring components that can handle multiple types of connections and wire configurations. Standardized connectors, mounting brackets, and sealing elements are designed to work with various wire sizes and types, allowing the same component to serve multiple functions and reducing the variety of parts needed in the complex wiring system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures a secure and water-tight connection between the LED module and housing, effectively protecting the wiring from environmental elements while allowing for the use of smaller gauge wires, enhancing the reliability and durability of the light fixture.

Implementation Method 1

a sponge gasket layer for sealing

Methodology Applied
Scientific EffectCompression deformation: Deformation

Data Source

PatentEP2142848B1Multi-led light fixture with secure arrangement for led-array wiring
Publication Date: 2014.08.06 WOLFSPEED INC
  • EP2142848B1 patent drawingFigure 1
  • EP2142848B1 patent drawingFigure 2
  • EP2142848B1 patent drawingFigure 3

AI summary

In an embodiment of an LED light fixture (10), the fixture includes a housing (20) defining a chamber (24) and an LED module (30) that is outside the chamber and adjacent to the housing. The LED module includes a mounting board (32) with a plurality of LED packages (34) mounted thereon and a cover (42) over the mounting board. The cover and the mounting board together form a module interior and the cover is configured to expose the LED packages. The improvement in this light fixture includes a rigid wireway (60) between the LED module and the housing and defining a passageway (62) between the module interior and the chamber.