Ring Assembly Wear Control via Multi-Point Shape Data
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Solution Overview
Problem
The existing etching control methods in plasma etching devices fail to accurately measure the wear of ring assemblies, leading to overestimation and frequent replacement, which increases operational costs and reduces productivity due to tilting of recesses near the substrate's periphery.
Innovation Solution
A method that collects shape data from multiple locations on the ring assembly using a distance sensor and applies a control amount based on a relationship model to adjust the DC voltage, ensuring the sheath distribution maintains the tilting angle within an allowable range, thereby reducing the frequency of ring assembly replacement and operational costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the ring assembly is monitored using conventional single-point measurement methods, then the measurement process is simple, but the wear measurement is inaccurate leading to overestimation and frequent replacement
Solution Approach 1:
The ring assembly surface is divided into multiple measurement locations (first, second, and third locations) around the substrate placement area. By measuring wear at multiple segmented points rather than a single point, the system achieves comprehensive and accurate wear assessment, preventing both overestimation and underestimation of ring assembly degradation.
Solution Approach 2:
The measurement system combines data from multiple measurement locations and integrates this information with a relationship model that correlates wear patterns to sheath distribution and tilting angle. This merging of multiple measurement points and data processing steps creates a comprehensive assessment system that accurately determines when ring assembly replacement is truly necessary.
2Manufacturing precision
If the ring assembly is replaced frequently based on overestimated wear, then the tilting quality issue is avoided, but operational costs increase and productivity decreases
Solution Approach 1:
The system implements a feedback mechanism where wear measurements at multiple locations are continuously monitored and fed into a relationship model. This model predicts sheath distribution and tilting angle, allowing the system to determine precisely when ring assembly replacement is necessary. This feedback loop prevents both premature replacement and operation beyond acceptable quality thresholds.
Solution Approach 2:
The invention changes the measurement parameters from single-point to multi-point assessment, and transforms the control approach from fixed-schedule replacement to condition-based replacement using wear data. By monitoring actual wear conditions and correlating them to tilting angle through a relationship model, the system optimizes the replacement timing to maintain manufacturing precision while maximizing productivity.
3Manufacturing precision
If the DC voltage to the ring assembly is adjusted to compensate for wear, then the sheath distribution and tilting angle are controlled, but the ring assembly wear measurement must be accurate to avoid worsening the tilting
Solution Approach 1:
By measuring wear at multiple segmented locations around the ring assembly rather than a single point, the system captures the actual wear distribution pattern. This segmented measurement approach provides accurate input data for the relationship model, enabling precise control of sheath distribution and tilting angle through DC voltage adjustment without being misled by inaccurate single-point measurements.
Data Source
AI summary
An etching control method includes (a) collecting shape data including height information of a ring assembly measured at a plurality of locations on a surface of the ring assembly, the ring assembly being disposed to surround an area on a stage on which a substrate is placed; (b) specifying a control amount from the shape data collected in (a) by using a relationship model representing a relationship between pre-collected shape data that has been collected in advance and a control amount capable of controlling a sheath distribution near the ring assembly by which a tilting angle of a recess formed in the substrate by plasma etching is within an allowable range; and (c) applying the control amount specified in (b) thereby controlling the sheath distribution near the ring assembly.