Ring-Like Bump Structure for Chip Package Coplanarity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in forming reliable packages with high integration density due to decreasing feature sizes, which complicates fabrication processes and affects the coplanarity of conductive bumps, impacting the yield of subsequent bonding processes.
Innovation Solution
A ring-like structure is formed around conductive bumps using an electroplating process, where the width of the trench is greater than the opening, resulting in a thinner ring-like structure compared to the bumps, improving coplanarity and yield by separating bumps from bump-less regions and allowing for improved bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If feature sizes are reduced to improve integration density, then more components can be integrated into a given area, but fabrication processes become more difficult and coplanarity of conductive bumps deteriorates
Solution Approach 1:
A ring-like structure is introduced as an intermediary element between the conductive bumps and the bump-less region. This ring structure serves as a mediator that isolates the bumps from the problematic bump-less region, thereby maintaining coplanarity without requiring changes to the bump formation process itself. The ring structure acts as a buffer zone that prevents the bump-less region from adversely affecting bump coplanarity.
Solution Approach 2:
The interconnect layer is segmented into distinct regions: a bump region with conductive bumps, a bump-less region adjacent to scribe lines, and a ring-like structure that separates these two regions. This segmentation allows each region to be optimized independently - the bumps can be formed with high precision while the ring structure compensates for the presence of the bump-less region.
2Ease of manufacture
If conventional electroplating is used to form conductive bumps, then conductive bumps can be formed, but the bump-less region adjacent to scribe lines causes poor coplanarity
Solution Approach 1:
The ring-like structure serves as an intermediary that isolates the conductive bumps from the bump-less region. By placing this ring structure between the bumps and the bump-less region, the negative influence of the bump-less region on coplanarity is eliminated while maintaining the simplicity of conventional electroplating processes.
Solution Approach 2:
The ring-like structure is formed in advance to prevent the harmful effect of the bump-less region from affecting bump coplanarity. This preliminary protective structure is created before final bump formation or bonding processes, proactively preventing coplanarity issues rather than correcting them afterward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ring-like structure enhances the coplanarity of conductive bumps, thereby improving the yield of the bonding process and facilitating more reliable chip package formation.
Implementation Method 1
A ring-like structure is formed around conductive bumps using an electroplating process
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive bump over and electrically connected to the chip. The chip package structure includes a ring-like structure over and electrically insulated from the chip. The ring-like structure surrounds the conductive bump, and the ring-like structure and the conductive bump are made of a same material.