Ring-Shaped Motor Drive Module for Compact Power Chip Layout

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Solution Overview

Problem

Existing drive modules for electric motors are large in size due to the arrangement of power chips, which hinders shape matching with the electric motor, leading to increased space occupation.

Innovation Solution

A drive module design featuring a power board in the shape of a ring or partial ring, with power chips distributed over copper substrates, a ring-shaped heat sink, and a ring-shaped housing to reduce size and match the motor's shape.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If power chips are arranged in a conventional layout, then the drive module can be manufactured with standard components, but the size of the drive module becomes large and cannot match the shape of the electric motor

Engineering Contradiction:
Improveshape matching with electric motorVSAvoidsize of drive module
Core Design Contradiction:
ShapeVSVolume of stationary object

Solution Approach 1:

The power board is designed with a curved or arc-shaped layout instead of a conventional straight or rectangular arrangement. The copper substrates and power chips are positioned along a curved path, enabling the drive module to match the cylindrical shape of the electric motor and reduce overall volume while maintaining functional integrity

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The power chips are arranged in a three-dimensional spatial configuration along the curved power board, utilizing vertical stacking and radial positioning to optimize space utilization. This dimensional transformation allows compact integration while preserving electrical performance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of stationary object

If the drive module size is reduced to match the motor shape, then space efficiency improves, but the arrangement of power chips becomes more difficult

Engineering Contradiction:
Improvesize of drive moduleVSAvoidarrangement of power chips
Core Design Contradiction:
Volume of stationary objectVSEase of manufacture

Solution Approach 1:

The power board is divided into multiple copper substrates arranged along the curved path, with power chips distributed across these segments. This segmentation allows modular manufacturing and assembly, simplifying the placement process while achieving the compact curved configuration

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The design employs flexible PCB materials and adjustable copper substrate dimensions to accommodate the curved layout. By changing physical parameters such as board flexibility, trace width, and component spacing, the manufacturing process is adapted to the non-conventional geometry without significantly increasing complexity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design allows for a compact drive module that fits the shape of the electric motor, reducing overall size and improving space efficiency.

Implementation Method 1

a heat sink disposed at a back surface of the power board

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a plurality of heat dissipation columns are provided on a surface of the heat sink

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP4593266A1Drive module for electric motor
Publication Date: 2025.07.30 ZF FRIEDRICHSHAFEN AG
  • EP4593266A1 patent drawingFigure 1
  • EP4593266A1 patent drawingFigure 2
  • EP4593266A1 patent drawingFigure 3

AI summary

The present application provides a drive module for an electric motor, the drive module comprising: a power board, which is in the shape of a ring or a partial ring and comprises a first insulating layer, an intermediate layer, and a second insulating layer, the intermediate layer having a receiving portion for receiving a plurality of power chips, the first insulating layer covering the receiving portion, and a source and a drain of each of the power chips leading out of the first insulating layer; a heat sink disposed at a back surface of the power board, the heat sink being in the shape of a ring or a partial ring; a control board connected to the power board, the control board being in the shape of a ring or a partial ring; an alternating current connector connected to the power board; and a housing having a cavity for receiving the power board, the heat sink and the control board, the housing and the cavity being both in the shape of a ring. In the present application, the power chips are distributed over a plurality of copper substrates, so that the power chips can be arranged on the power board in the shape of a ring while enabling the size of the drive module to be reduced. In addition, the drive module of the present application can be shaped to match the shape of the electric motor.