Ring-Shaped Dummy Die Layout for Fan-Out Package Warpage
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Solution Overview
Problem
Integrated fan-out packages face challenges in warpage control, which is crucial for reliability improvement, and existing methods lack efficient solutions for compactness and fabrication simplicity.
Innovation Solution
A process involving a ring-shaped dummy die and integrated circuit dies mounted on a carrier with an insulating encapsulation and redistribution circuit structure, where the dummy die provides warpage control and is electrically floating, simplifying fabrication and reducing costs by minimizing pickup and placement times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate dummy dies are used for warpage control, then warpage control effectiveness is improved, but device complexity and fabrication time increase
Solution Approach 1:
The patent combines multiple separate dummy dies into a single integrated ring-shaped dummy die that surrounds the active dies. This single ring structure performs the warpage control function that would otherwise require multiple separate dummy dies, thereby reducing fabrication steps and overall device complexity while maintaining effective warpage control across the package substrate.
Solution Approach 2:
The ring-shaped dummy die serves multiple functions simultaneously: it provides warpage control for the entire package substrate, acts as a structural support element, and creates a unified boundary structure. This multi-functionality eliminates the need for multiple specialized components, simplifying the overall device architecture.
2Reliability
If multiple separate dummy dies are used for warpage control, then warpage control effectiveness is improved, but manufacturing time increases
Solution Approach 1:
By merging multiple dummy die placement operations into a single ring-shaped dummy die, the patent reduces the number of pickup and placement cycles required during fabrication. This single structure can be placed in one operation, significantly reducing manufacturing time compared to placing multiple separate dummy dies individually.
Solution Approach 2:
The ring-shaped dummy die is designed and prepared as a complete integrated structure before placement, allowing it to be installed in a single preliminary action rather than requiring multiple sequential placements of individual dummy dies. This preliminary preparation of the unified ring structure streamlines the fabrication process.
3Reliability
If the dummy die is electrically connected to the redistribution circuit structure, then electrical functionality is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the electrical connection requirement from the dummy die structure by making the ring-shaped dummy die electrically floating (disconnected). This separation allows the dummy die to focus solely on its mechanical warpage control function, while electrical connections are handled exclusively by the active dies and redistribution circuit structure, simplifying the manufacturing process.
Solution Approach 2:
The dummy die is designed as a non-functional, electrically isolated element whose sole purpose is mechanical support and warpage control. By making it electrically floating, the patent simplifies manufacturing since no electrical connections need to be established to the dummy die, reducing fabrication complexity and cost.
Data Source
AI summary
A method of fabricating an integrated fan-out package is provided. A ring-shaped dummy die and a group of integrated circuit dies are mounted over a carrier, wherein the group of integrated circuit dies are surrounded by the ring-shaped dummy die. The ring-shaped dummy die and the group of integrated circuit dies over the carrier are encapsulated with an insulating encapsulation. A redistribution circuit structure is formed on the ring-shaped dummy die, the group of integrated circuit dies and the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the group of integrated circuit dies, and the ring-shaped dummy die is electrically floating.