Ring Frame Mechanical Cleaning With Optical Residue Inspection
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Solution Overview
Problem
The existing methods for cleaning and inspecting ring frames used in semiconductor wafer dicing processes are inefficient, relying on chemical-based methods that are environmentally unfriendly and economically unfeasible, and require manual inspection, which is time-consuming and lacks high-resolution detection.
Innovation Solution
A system and method utilizing mechanical blades and wheel brushes for residue removal, combined with an automated optical inspection system for high-throughput and high-resolution detection of cleanness, eliminating the need for chemical cleaning and manual inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemical cleaning methods are used to remove tape residues, then cleaning effectiveness is achieved, but environmental harm and economic cost increase due to large amounts of acid waste and chemicals needed
Solution Approach 1:
The patent replaces chemical cleaning methods with a mechanical cleaning system consisting of a robotic arm equipped with cleaning elements (blades and brushes) that physically remove tape residues from ring frames, eliminating the need for harmful chemicals while maintaining cleaning effectiveness
Solution Approach 2:
The patent changes the cleaning mechanism from chemical to mechanical by modifying the cleaning system parameters - using a robotic arm with controllable cleaning elements that apply mechanical force to remove residues, fundamentally altering the cleaning approach from chemical reaction to physical removal
2Measurement precision
If manual inspection is used to detect residue particles, then inspection can be performed, but time consumption increases and throughput decreases due to trade-off between inspection resolution and sampling rate
Solution Approach 1:
The patent replaces manual visual inspection with an automated optical inspection system using a camera and image processing algorithms that automatically detect and classify residue particles, eliminating the trade-off between resolution and throughput by enabling high-resolution inspection at high speed
Solution Approach 2:
The inspection system performs self-inspection by automatically capturing images, processing them through algorithms, identifying residue particles, and making decisions about ring frame cleanliness without human intervention, enabling continuous high-throughput operation with high-resolution detection
3Productivity
If high sampling rate is used in manual inspection, then throughput increases, but inspection resolution decreases due to time-resource trade-off
Solution Approach 1:
The patent substitutes manual inspection with an automated optical system that can process images at high speed while maintaining high resolution, using a camera with sufficient pixel density and processing algorithms that can analyze multiple images per second without compromising detection accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mechanical cleaning method effectively removes adhesive residues without chemicals, while the automated optical inspection ensures high-resolution detection of residue presence, enhancing throughput and reducing manual inspection-related inefficiencies.
Implementation Method 1
an automated optical inspection system is used to replace manual inspection and to automatically detect the cleanness of the ring frames after cleaning
Data Source
AI summary
A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.