Ring-Shaped Hot Spot IC with Multidirectional Cooling
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Solution Overview
Problem
As integrated circuits experience increased power density and heat generation due to performance enhancements, conventional cooling technologies struggle to effectively manage heat dissipation, particularly in high-performance applications like GPUs and AI services, leading to the need for advanced cooling solutions.
Innovation Solution
The arrangement of high-power density electronic components in ring-shaped hot spot areas on the integrated circuit surface, combined with a fin array cold plate that provides multidirectional cooling, allows for enhanced heat dissipation by increasing the perimeter-to-area ratio and ensuring uniform cooling across the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional cooling technologies are used, then the cooling structure is simple, but heat dissipation effectiveness is insufficient for high power density chips
Solution Approach 1:
The cooling system is segmented into multiple independent cooling channels arranged in a grid pattern, with each channel providing localized cooling to specific regions of the chip. This segmentation allows for targeted heat removal from high-power-density areas while maintaining a relatively simple overall structure that can be manufactured using conventional techniques.
2Productivity
If high power density components are placed in central area, then computing performance increases, but heat concentration creates hot spots that are difficult to cool
Solution Approach 1:
The cooling system implements local quality by providing varying cooling intensities to different chip regions. High-power-density areas receive enhanced cooling through dedicated cooling channels with optimized flow rates, while low-power-density areas receive proportionally less cooling. This localized approach effectively manages hot spots without requiring uniform over-cooling of the entire chip.
3Loss of energy
If cooling channels are added to manage heat, then heat dissipation improves, but manufacturing complexity and cost increase
Solution Approach 1:
The cooling plate structure serves multiple functions simultaneously: it provides thermal management through integrated cooling channels, acts as a structural support layer for the chip, and facilitates heat distribution across the chip surface. This multi-functionality eliminates the need for separate cooling components, thereby simplifying manufacturing while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves temperature regulation and heat dissipation, enabling the fabrication of higher performance and power density components on smaller integrated circuits while maintaining efficient cooling without increasing heat loads on components.
Implementation Method 1
a fin array cold plate that provides multidirectional cooling
Data Source
AI summary
Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.