Ring Housing PCB Alignment for Accurate Optoelectronic Assembly
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Solution Overview
Problem
Wearable devices face challenges in accurately integrating optoelectronic components due to size and precision requirements, leading to unreliable physiological measurements, and there is a need for improved durability and efficient manufacturing.
Innovation Solution
The use of alignment features on a printed circuit board (PCB) and housing components, such as x-direction locators, y-direction locator edges, and z-direction location surfaces, ensures precise placement of optoelectronic components within the wearable device's apertures, enhancing accuracy and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optoelectronic components are integrated into the wearable device housing, then the device can perform physiological measurements, but the placement precision and alignment accuracy deteriorate due to size constraints and manufacturing challenges
Solution Approach 1:
The patent applies preliminary action by incorporating alignment features (protrusions and recesses) into the PCB and housing structures before final assembly. These pre-formed mechanical guides ensure that when the PCB is inserted into the housing, the optoelectronic components are automatically positioned with high precision relative to the apertures, eliminating the need for post-assembly alignment adjustments and ensuring reliable measurements.
2Manufacturing precision
If the wearable device structure is made more complex to improve measurement accuracy, then component alignment improves, but the device durability and manufacturing efficiency deteriorate
Solution Approach 1:
The patent applies segmentation by dividing the alignment function into separate, dedicated features: protrusions on the PCB and corresponding recesses on the housing. This segmentation allows each component to maintain its primary structural integrity while incorporating specialized alignment elements. The modular alignment features can be independently optimized and do not compromise the overall structural strength or require complex integrated designs.
3Ease of manufacture
If traditional assembly methods are used without specialized alignment features, then manufacturing is simpler, but the optoelectronic component placement accuracy deteriorates leading to unreliable measurements
Solution Approach 1:
The patent applies self-service through self-aligning mechanical features where the protrusions on the PCB automatically engage with the recesses in the housing during assembly. This self-aligning mechanism guides the PCB into the correct position without requiring external alignment tools, complex jigs, or skilled manual adjustment, thereby maintaining manufacturing simplicity while achieving high placement precision for reliable physiological measurements.
Data Source
AI summary
Methods, systems, and devices for ring-shaped housing alignment features are described. The wearable ring device may include an inner shell and a printed circuit board. The inner shell may include a plurality of apertures, a first set of alignment features including planar regions that are formed into an arcuate ridge of the inner shell, and a second set of alignment features. The plurality of apertures may be aligned within the planar regions. The printed circuit board may include optoelectronic components and rigid regions. The rigid regions are configured to engage with the first set of alignment features to align the optoelectronic components in a first direction, and one or more features of the printed circuit board are configured to engage with the second set of alignment features to align the optoelectronic components in other directions such that the optoelectronic components are aligned with the plurality of apertures.