Ring-Lattice Chip Assembly Structure for Shift-Free Bonding
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Solution Overview
Problem
Semiconductor chips experience shifting and damage during assembly due to dislocations and silicon peeling, leading to inoperable or poor-quality devices.
Innovation Solution
A semiconductor device structure featuring a ring structure with a lattice of cells that retains semiconductor chips in place, using binding components within the ring structure and lattice to secure connection components, thereby preventing shifting and encapsulating the chips within a housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor chips are mounted using solder alloy reflow or conductive epoxy, then connection between chips and substrate is achieved, but chip shifting and silicon peeling occur during assembly
Solution Approach 1:
The patent introduces a lattice structure with multiple cells that segments the bonding area into discrete regions. Each cell contains binding components that independently secure the chip at multiple points, preventing overall chip shifting while allowing controlled thermal expansion. The lattice divides the chip surface into zones, each with its own retention mechanism, thereby stabilizing chip position during assembly.
Solution Approach 2:
The patent introduces a ring structure as an intermediary element between the chip and the substrate. This ring structure contains the lattice and provides additional mechanical support, acting as a mediator that distributes stresses and prevents direct contact between the chip edges and substrate, thereby preventing silicon peeling while maintaining connection reliability.
2Strength
If binding components are applied to secure chips, then connection strength is improved, but chip shifting occurs due to dislocations
Solution Approach 1:
The lattice structure is pre-formed on the substrate before chip mounting. This preliminary structure provides predetermined positioning features and binding component locations that guide chip placement. The pre-configured lattice cells establish exact positions for binding components, ensuring precise chip positioning while maintaining strong bonding when components are applied.
Solution Approach 2:
The patent applies binding components locally within specific lattice cells rather than uniformly across the entire chip surface. Each cell can be optimized with appropriate binding component density and type based on local stress requirements. This localized approach maintains manufacturing precision by concentrating bonding strength only where needed, preventing chip shifting at critical locations without affecting overall positioning accuracy.
3Ease of manufacture
If a simple mounting structure is used, then manufacturing complexity is reduced, but chip damage occurs through dislocations and peeling
Solution Approach 1:
The patent merges multiple functions into the ring structure and lattice combination. The ring structure provides mechanical support and edge protection, while the embedded lattice provides positioning and bonding pathways. This merged structure simultaneously prevents chip shifting, silicon peeling, and thermal stress damage without requiring separate complex systems, thereby maintaining manufacturing simplicity while improving chip integrity.
Solution Approach 2:
The lattice structure serves multiple functions: it provides mechanical support, defines bonding locations, facilitates heat dissipation pathways, and prevents both chip shifting and silicon peeling. This multi-functional design eliminates the need for separate components for each protection mechanism, maintaining ease of manufacture while comprehensively protecting chip integrity through a single integrated structure.
Data Source
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AI summary
A semiconductor device, apparatus, structure, and associated methods thereof. The device includes a semiconductor chip, a ring structure configured to retain a lattice having a plurality of cells, the ring structure and the lattice being coupled to the semiconductor chip, one or more semiconductor device connection components being coupled to the semiconductor chip using one or more binding components disposed within the ring structure and the lattice, and a housing configured to encapsulate the semiconductor chip, the ring structure and the lattice, and the one or more semiconductor device connection components.