Ring Mash Bonding Control for Ferrous Material Strength
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Solution Overview
Problem
The ring mash bonding method for electrically bonding ferrous materials results in bonded parts that are prone to undesired quenching, leading to hardness and brittleness, and requires tempering, which can be inconsistent due to variations in bonding dimensions and currents, causing mechanical strength issues and inefficient power usage.
Innovation Solution
Incorporating a relative displacement amount setting portion with a current conduction suppressing layer on either bonding target member to control the displacement and current flow during bonding, ensuring that the post-heating current primarily flows through the bonded portion, thereby maintaining mechanical strength and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ring mash bonding is used to electrically bond ferrous materials, then high bonding strength is achieved, but undesired quenching occurs causing the bonded part to become harder and more brittle with lower mechanical strength
Solution Approach 1:
The patent applies preliminary action by introducing a heating current before the bonding current to preheat the bonded part. This preheating prevents undesired quenching during bonding by ensuring the material is already at an appropriate temperature, thereby maintaining mechanical strength while achieving high bonding strength through the subsequent bonding process.
2Reliability
If heating current is applied after bonding to temper the bonded part, then mechanical strength is improved, but power consumption increases and tempering effect becomes inconsistent
Solution Approach 1:
The patent merges the heating function and bonding function into a single integrated process. By superimposing the heating current and bonding current in time, the heating current serves dual purposes: it preheats the material to prevent quenching and simultaneously prepares the material for bonding. This eliminates the need for separate post-bonding tempering, reducing power consumption while maintaining consistent mechanical strength.
Solution Approach 2:
The patent ensures continuity of useful action by making the heating current continuous throughout the bonding process rather than applying it separately before or after. This continuous heating maintains the material at the appropriate temperature throughout bonding, preventing quenching and eliminating the need for additional tempering steps, thereby reducing overall power consumption while ensuring consistent results.
3Reliability
If heating current is applied after bonding, then tempering effect is achieved, but current flows through contact points causing variation in tempering effect and inefficient power usage
Solution Approach 1:
The patent applies preliminary action by performing the heating function before bonding rather than after. The heating current is applied in advance to preheat the bonded part, eliminating the need for post-bonding heating that would cause current to flow through contact points. This preliminary heating ensures consistent tempering effect without power loss at contact points during the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the mechanical strength of bonded articles against vibrations and impact forces while maintaining consistent bonding strength and reducing the need for high post-heating currents, thus improving the reliability and efficiency of the bonding process.
Implementation Method 1
applying a current, in this state, to the first and second bonding target members under pressure until their bonding target portions undergo plastic flow
Implementation Method 2
the bonded part needs to be tempered by applying a heating current to it after electrical bonding
Data Source
AI summary
To bond bonding target members stacked on top of each other without generating dust or spatter into an electrically bonded article with improved mechanical strength against strong vibration etc. A first bonding target member or second bonding target member includes a relative displacement amount setting portion for setting the distance by which the bonding target portion of the first member and the bonding target portion of the second member are relatively displaced during bonding, and a current conduction suppressing layer is formed on the relative displacement amount setting portion. The second or first member includes a setting face that is placed opposed to the current conduction suppressing layer of the first or second member. In a state where the first and second members have been positioned, the distance between the current conduction suppressing layer and the setting face is equal to the width H of the bonded portion.