Ring-Shaped Metal Layer Protrusion for Electronic Component Adhesion
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Solution Overview
Problem
The adhesion between the side surface of the ring-shaped metal layer and the metal film is weak, leading to the metal film peeling off and failing to properly protect the metal sealer in electronic components.
Innovation Solution
An electronic component design featuring a ring-shaped metal layer with a protruding part along its outer periphery, where the metal sealer is bonded to the ring-shaped metal layer, and a protective metal film is applied to the side surfaces of the metal sealer and ring-shaped metal layer, enhancing adhesion and bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal film is provided on side surfaces of the ring-shaped metal layer and metal sealer, then the protective function is improved, but the adhesion between the metal film and ring-shaped metal layer becomes weak causing peeling
Solution Approach 1:
The invention transforms the flat ring-shaped metal layer into a three-dimensional structure with protruding parts that extend upward. This dimensional change increases the surface area and creates mechanical interlocking features that enhance adhesion between the ring-shaped metal layer and both the metal sealer and metal film, preventing peeling while maintaining protective function
Solution Approach 2:
The invention creates a composite structure where the ring-shaped metal layer with protruding parts, metal sealer, and metal film form an integrated assembly. The protruding parts act as mechanical anchors that bond the different materials together, creating a composite system with enhanced overall adhesion and protective capability
Data Source
AI summary
An electronic component includes: a substrate; a device chip, in which a functional element is located on a lower surface thereof, that is mounted on an upper surface of the substrate so that the functional element and the upper surface of the substrate are opposite to each other via an air gap; a ring-shaped metal layer that is located on the upper surface of the substrate, surrounds the device chip in a plan view, and has a protruding part located along an outer periphery thereof, an outer side surface of the ring-shaped metal layer being higher than an inner side surface thereof; a metal sealer that surrounds the device chip in the plan view, and is bonded on an upper surface of the ring-shaped metal layer; and a metal film that is located on side surfaces of the metal sealer and the ring-shaped metal layer.