Ring-Shaped Metal Sealing Adhesion in SAW Resonators
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Solution Overview
Problem
The adhesion between the side surface of the ring-shaped metal layer and the metal film in electronic components is weak, leading to the metal film peeling from the ring-shaped metal layer, which prevents proper protection of the metal sealing portion.
Innovation Solution
An electronic component design where the side surface of the ring-shaped metal layer is positioned further in than the substrate's side surface, with a recess portion formed on the side surface of the ring-shaped metal layer, and a metal film is applied on the side surfaces of both the metal sealing portion and the ring-shaped metal layer, enhancing adhesion and preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal film is formed on the side surface of the ring-shaped metal layer, then the protective function is improved, but the adhesion between the metal film and the ring-shaped metal layer is weak causing peeling
Solution Approach 1:
The patent solves the adhesion problem by transitioning from a two-dimensional flat surface to a three-dimensional structured surface. The ring-shaped metal layer is formed with a protrusion extending in the thickness direction, creating a stepped structure. When the metal film is deposited, it conforms to this three-dimensional topology, forming a mechanical interlock that significantly enhances adhesion strength and prevents peeling while maintaining the protective function.
2Strength
If the side surface of the ring-shaped metal layer is positioned further in than the substrate side surface, then adhesion is improved, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the ring-shaped metal layer into distinct structural zones: a base portion and a protrusion portion extending upward. This segmentation creates the stepped configuration that improves adhesion while maintaining manufacturing feasibility through standard thin-film deposition techniques, balancing structural enhancement with manufacturing simplicity.
Data Source
AI summary
An electronic component includes: a substrate; a device chip including a functional element located on a lower surface thereof and mounted on an upper surface of the substrate so that the functional element faces the upper surface of the substrate across an air gap; a ring-shaped metal layer located on the upper surface of the substrate and surrounding the device chip in plan view, a side surface of the ring-shaped metal layer being located further in than a side surface of the substrate; a metal sealing portion surrounding the device chip in plan view and bonding with an upper surface of the ring-shaped metal layer, a side surface of the metal sealing portion being located further out than the side surface of the ring-shaped metal layer; and a metal film located on the side surface of the metal sealing portion and the side surface of the ring-shaped metal layer.