Ring-Shaped Thin Slit Heat Exchanger for Uniform Adhesive Heating
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Solution Overview
Problem
Hot melt adhesive materials exhibit thermal insulative properties, leading to uneven heat distribution, with regions near the heater being hotter than those farther away, and the materials do not flow in a manner that encourages heat distribution, resulting in inefficient heating and potential degradation at elevated temperatures.
Innovation Solution
A heat exchange device with fluid passageways featuring thin slit sections is used to direct and heat the liquid adhesive material, providing even and thorough heating by applying heat from both sides of the adhesive flow, reducing energy consumption and minimizing temperature-related degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heating methods are used with bulk liquid adhesive material, then the heater can provide sufficient heat, but the heat is not evenly distributed throughout the adhesive material due to its thermal insulative properties
Solution Approach 1:
The liquid adhesive material is divided into thin filament sections as it flows through the heating device. Each filament is heated individually and uniformly by the heating element, eliminating the thermal insulation problems associated with bulk material heating. The segmented structure increases the surface area-to-volume ratio, enabling efficient and uniform heat transfer.
Solution Approach 2:
The invention transitions from heating bulk three-dimensional adhesive material to heating two-dimensional thin filaments. This dimensional reduction allows heat to penetrate completely through the adhesive cross-section, achieving uniform temperature distribution. The adhesive is extruded through a plate with orifices that create thin filaments, fundamentally changing the geometry to improve heat transfer.
2Ease of operation
If the liquid adhesive material is maintained at elevated temperatures for extended periods, then it remains in a workable state, but degradation effects occur
Solution Approach 1:
The adhesive material is rapidly extruded through the heating device as thin filaments and immediately applied to the substrate. This quick passage through the heating zone minimizes the residence time at elevated temperatures, preventing degradation while still achieving the necessary heating for proper adhesion. The process skips the prolonged heating phase that would cause degradation.
Solution Approach 2:
The invention changes the physical state and geometry parameters of the adhesive material - extruding it as thin filaments with high surface area-to-volume ratio. This parameter change allows the adhesive to be heated efficiently and quickly, then rapidly cooled upon contact with the substrate, maintaining workability while preventing thermal degradation.
3Ease of operation
If the adhesive material flows in bulk form, then it can be easily handled, but it does not flow in a manner that encourages heat distribution
Solution Approach 1:
The adhesive is segmented into multiple thin filaments as it flows through the heating device. This segmentation transforms the bulk flow into numerous small-scale flows, each experiencing efficient heat transfer. The segmented structure maintains ease of handling while fundamentally improving heat distribution characteristics.
Solution Approach 2:
The invention uses fluid dynamics principles to extrude the adhesive material through a plate with orifices, creating controlled thin filaments. The hydraulic flow through the orifices naturally forms the filament structure that promotes heat distribution, combining ease of handling with improved thermal characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat exchange device effectively maintains the adhesive material at lower temperatures before heating, conserving energy and ensuring uniform heating, thus preventing degradation and achieving efficient temperature control for adhesive bonding applications.
Implementation Method 1
a heating element thermally coupled with the body and configured for heating the liquid adhesive material flowing through the fluid passageway to the application temperature
Data Source
Figure 1~3
Figure 2
Figure 4
AI summary
A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section in the form of an elongated ring shape, having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section.