Ring Stiffener Wedge Thermal Path for IC Heat Dissipation
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Solution Overview
Problem
Electronic devices with integrated circuit (IC) dies face thermal management challenges due to accumulation of heat, which can alter physical characteristics and increase metal migration, leading to deleterious effects such as varied threshold voltages and increased thermal energy migration.
Innovation Solution
The implementation of an electronic device apparatus with multiple thermally conductive paths, including a ring stiffener and a heat sink, where the ring stiffener is disposed around the IC die on a package substrate and thermally coupled to a wedge, forming a conductive path with the heat sink for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single heat dissipation path is used, then the device structure is simple, but heat dissipation efficiency is insufficient leading to thermal accumulation
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent thermal conduction paths: (1) IC die to package substrate to heat sink, (2) IC die to ring stiffener to wedge to heat sink, and (3) IC die to lead frames to heat sink. Each path operates independently to transfer heat from the IC die to the heat sink, increasing overall heat dissipation efficiency without creating complex inter-dependent systems.
Solution Approach 2:
The patent combines multiple thermal conduction paths into a unified thermal management system that converges at the heat sink. The ring stiffener, wedge, package substrate, and lead frames all serve as parallel thermal conduction channels that merge their heat transfer functions at the heat sink, achieving synergistic heat dissipation while maintaining relatively simple individual component structures.
2Reliability
If thermal energy accumulates in the IC die, then the device structure remains simple, but physical characteristics are altered and metal migration increases
Solution Approach 1:
The patent segments the thermal management function across multiple components (package substrate, ring stiffener, wedge, lead frames, heat sink) to prevent thermal accumulation in the IC die. By distributing the heat dissipation function across these segmented paths, the system maintains IC die stability and prevents thermal-related degradation without requiring a single complex thermal management structure.
3Temperature
If the ring stiffener is extended to increase surface area, then heat dissipation improves, but the device dimensions increase
Solution Approach 1:
The patent extends the ring stiffener laterally beyond the package substrate edges in the horizontal plane, utilizing the lateral dimension to increase the thermal conduction surface area. This dimensional extension allows the ring stiffener to contact the wedge and heat sink over a larger area, improving heat dissipation efficiency without significantly increasing the vertical height or requiring additional lateral space beyond the extended ring perimeter.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency by providing additional surface area for heat transfer, preventing overheating and reducing thermal contamination between IC circuits, thereby maintaining optimal operating temperatures and extending the lifespan of the IC die.
Implementation Method 1
A thermally conductive path from the IC die to the heat sink includes the ring stiffener and the wedge
Implementation Method 2
a heat sink disposed on the package
Data Source
AI summary
Examples described herein provide for an electronic device apparatus with multiple thermally conductive paths for heat dissipation. In an example, an electronic device apparatus includes a package comprising a die attached to a package substrate. The electronic device apparatus further includes a ring stiffener disposed around the die and on the package substrate, a heat sink disposed on the package, and a wedge disposed between the heat sink and the ring stiffener.