Ring-Shaped Through-Via-Hole Array for PCB Noise Suppression
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Solution Overview
Problem
Conventional methods for suppressing ground bounce noise in high-speed digital circuits increase circuit complexity, cost, and space, and lead to signal quality and electromagnetic radiation issues, while the use of high dielectric constant cylinders is costly and complex.
Innovation Solution
A ring-shaped through-via-hole array structure is formed between high voltage and low voltage planes using blind via holes in a printed circuit process, creating an omnidirectional noise suppression frequency band that avoids the drawbacks of capacitor walls and high dielectric constant manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an enclosed capacitor wall is used to suppress ground bounce noise, then noise suppression effectiveness is improved, but circuit complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent changes the structural parameters of the power plane by introducing rectangular crevices with specific dimensions and arrangements. These crevices act as noise containment structures without requiring additional capacitor components, thus suppressing ground bounce noise while avoiding the complexity of capacitor walls
Solution Approach 2:
The power plane is segmented into multiple regions by creating rectangular crevices that divide the plane into isolated sections. This segmentation contains electromagnetic noise within specific areas and prevents noise propagation, achieving noise suppression through structural division rather than additional components
2Reliability
If multiple capacitors are peripherally provided on the IC to form a capacitor wall, then ground bounce noise is suppressed, but the space and cost of the integrated circuit increase
Solution Approach 1:
The patent merges the noise suppression function with the existing power plane structure by integrating rectangular crevices directly into the plane. This combines the structural support function with the electromagnetic noise containment function, eliminating the need for separate capacitor components and reducing overall space requirements
Solution Approach 2:
The patent extracts the noise suppression capability from external capacitor components and embeds it directly into the power plane structure through crevices. This extraction eliminates the need for separate passive components while maintaining the noise containment function
3Reliability
If crevices are cut on the power plane to contain noise, then ground bounce noise is suppressed, but signal quality deteriorates due to crevice crossings
Solution Approach 1:
The patent applies different structural qualities to different regions: signal lines are routed to avoid crevice crossings in critical areas, while crevices are strategically positioned in regions where they provide noise containment without intersecting signal paths. This local optimization maintains signal quality while achieving noise suppression
4Reliability
If crevices are cut on the power plane, then noise containment is improved, but electromagnetic radiation increases due to signal line crossings
Solution Approach 1:
The patent optimizes the local arrangement of crevices and signal lines to prevent intersections in areas where electromagnetic radiation would be generated. Crevices are positioned to contain noise while signal lines are routed through regions that minimize radiation, achieving both noise containment and electromagnetic compatibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses ground bounce noise with a lower cost and reduced space requirements, while preventing signal quality and electromagnetic radiation issues, offering a more efficient and cost-effective noise suppression method.
Implementation Method 1
a ring-shaped through-via-hole array structure is formed between high voltage and low voltage planes using blind via holes in a printed circuit process, creating an omnidirectional noise suppression frequency band
Data Source
AI summary
Proposed is an apparatus for silencing electromagnetic noise, characterized by a plurality of centrally symmetrical ring-shaped through-via-hole crystalline units provided between a high voltage plane and a low voltage plane at a regular interval, thereby forming an omnidirectional noise suppression frequency band for reducing noise interference and electromagnetic radiation. In a first embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between a metal plane and the low voltage plane. In a second embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between two metal planes. Positioned at a regular interval, the through via holes enable provision of omnidirectional noise suppression frequency band, simplified design of a power plane, and reduction of production costs.