Universal Ring Wafer Support With Venting for Clean Vacuum Handling
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Solution Overview
Problem
Conventional wafer support technologies face challenges such as outgassing, contamination transfer, and complexity in vacuum environments, which compromise the reliability and cleanliness of semiconductor fabrication processes.
Innovation Solution
A universal ring wafer support apparatus is designed with a circular main body, circular raised sections for different wafer diameters, a centrally disposed raised island for grounding, and vent holes for efficient gas removal, minimizing outgassing and contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vacuum chuck support is used, then uniform and reliable wafer fixation is achieved, but system complexity and cost increase due to separate vacuum system requirements
Solution Approach 1:
The patent integrates the vacuum chuck support functionality directly into the wafer support apparatus structure, merging the vacuum generation and wafer fixation functions into a single integrated system. This eliminates the need for separate vacuum systems while maintaining reliable wafer fixation through distributed vacuum ports in the support structure.
Solution Approach 2:
The wafer support apparatus is designed with multi-functionality, serving both as a mechanical support structure and as a vacuum chuck system. The same structural components provide both structural integrity and vacuum-based wafer fixation, reducing overall system complexity while maintaining reliability.
2Force
If electrostatic clamp support is used, then strong holding force without physical contact is achieved, but vulnerability to electrostatic discharge and complexity in voltage control increase
Solution Approach 1:
The patent replaces electrostatic-based holding mechanisms with a mechanical vacuum-based system. Instead of using electrical fields to hold wafers, the invention uses mechanical vacuum pressure applied through distributed ports, eliminating electrostatic discharge risks while maintaining strong holding force.
3Stability of the object's composition
If solid plate support is used, then structural stability is achieved, but outgassing occurs in vacuum environments compromising cleanliness
Solution Approach 1:
The patent employs a porous or mesh-like support structure instead of solid plates. This porous construction maintains structural stability while allowing vacuum penetration and reducing outgassing volume. The increased surface area and open structure enable better vacuum access and reduce trapped gas pockets that cause outgassing issues.
Solution Approach 2:
The support structure is segmented into multiple sections with distributed vacuum ports rather than a solid continuous plate. This segmentation reduces the total volume of material that can outgas while maintaining structural integrity through the distributed framework design.
4Ease of operation
If conventional wafer support is used, then basic support function is achieved, but contamination transfer risk increases in vacuum environments
Solution Approach 1:
The patent incorporates flexible barrier films or shells in the wafer support design that create controlled separation between the wafer and the support structure. These flexible barriers prevent direct contact contamination while allowing the necessary support and vacuum functions, reducing contamination transfer risk in vacuum environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The universal ring wafer support apparatus ensures robust wafer grounding, minimizes outgassing, and reduces contamination transfer, enhancing the reliability and cleanliness of semiconductor fabrication processes.
Implementation Method 1
a plurality of vent holes formed through the main body and configured to surround the circular raised island
Implementation Method 2
a first outer contact material extending along a top portion of the circular shaped raised section and a second inner contact material extending along a top portion of the circular shaped raised section
Data Source
AI summary
A universal ring wafer support apparatus that includes at least one raised support to securely support different size wafers above and separated from the main body to enable dust, particles and contaminants to flow away from a wafer and through the main body to a back side thereof. The universal ring wafer support apparatus and the at least one raised support is formed of a highly conductive material while a top surface of the at least one raised support includes contact material(s) or pucks having a high gripping force to grip and securely support a wafer thereon.