Ring-Wall Inverter Layout for Direct Heat Dissipation
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Solution Overview
Problem
In power conversion devices, the heat dissipation effect is compromised when semiconductor modules are stacked in the thickness direction of the outer peripheral wall, leading to excessive temperature and heat transfer between adjacent modules.
Innovation Solution
A power conversion device design featuring a case with a ring-shaped outer peripheral wall, where multiple heat generation components are arranged in a circumferential direction and in contact with the inner peripheral surface of the outer peripheral wall, allowing for direct heat transfer and dissipation through the outer peripheral surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor modules are stacked in the thickness direction of the outer peripheral wall, then the device can accommodate multiple heat generation components in a compact space, but the heat dissipation effect is compromised and temperature becomes excessively high
Solution Approach 1:
The patent transitions from stacking modules in the thickness direction (one-dimensional arrangement) to arranging modules in the circumferential direction (utilizing the ring-shaped outer peripheral wall's circumference). This dimensional change allows heat to be dissipated radially outward through the outer peripheral surface, solving the heat dissipation problem while maintaining compactness.
2Volume of stationary object
If semiconductor modules are stacked in the thickness direction, then space utilization is improved, but heat from one module is transferred to adjacent modules causing excessive temperature
Solution Approach 1:
The patent segments the heat dissipation path by providing each semiconductor module with its own dedicated heat dissipation route through the outer peripheral wall. The modular arrangement in the circumferential direction ensures that heat from each module dissipates independently through the outer peripheral surface, preventing heat accumulation and transfer between adjacent modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the heat dissipation effect by allowing direct heat transfer from the heat generation components to the inner surface and subsequent dissipation from the outer surface, preventing excessive temperature and reducing heat transfer between modules.
Implementation Method 1
multiple heat generation components that are arranged in a circumferential direction of the outer peripheral wall, are in contact with an inner peripheral surface of the outer peripheral wall, and generate heat by energization, in which an outer peripheral surface of the outer peripheral wall is a heat dissipation surface that dissipates heat, which is transferred from the heat generation component to the inner peripheral surface, to an outside
Data Source
AI summary
An inverter device includes an inverter housing and an arm switch unit. The inverter housing includes an inverter outer peripheral wall and an inverter fin. The inverter outer peripheral wall has an outer peripheral surface and an inner peripheral surface and extends annularly around an inverter axis. The inverter fin is provided on the outer peripheral surface and extends toward a radially outer side from the outer peripheral surface. Multiple arm switch units are arranged in a circumferential direction and are fixed to the inner peripheral surface. The arm switch unit is a heat generation component that generates heat by energization. Heat transferred to the inner peripheral surface from the arm switch unit is dissipated to the outside from the outer peripheral surface of the inverter outer peripheral wall.