Ringframe Thermal Spreader With Straps for Space Heat Dissipation

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Solution Overview

Problem

In space and other applications where convection is inadequate or impossible, there is a need for effective thermal management of semiconductor devices that can handle thermal energy removal from multiple directions and withstand thermal cycles and vibrations without causing fatigue and stress on solder bonds and thermal interface materials.

Innovation Solution

A thermal spreader comprising a ringframe with openings to accommodate semiconductor devices and pairs of thermal straps that are bonded to the devices and fastened to the ringframe, facilitating the transfer of thermal energy from the devices to the ringframe for removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal energy is removed via convection or through solder balls/columns, then thermal management is achieved, but thermal stress and fatigue on solder bonds and thermal interface materials increase in space applications

Engineering Contradiction:

Improvethermal energy removalVSAvoidstress on solder bonds and thermal interface materials

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The thermal management system is segmented into multiple independent thermal straps that contact different regions of the semiconductor device. Each thermal strap independently conducts thermal energy away from the device, distributing the thermal management function across multiple pathways rather than relying on a single convection path or solder joints, thereby reducing stress concentration on any single bond or interface material.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Thermal straps serve as intermediary elements between the semiconductor device and the heat sink. These straps act as dedicated thermal conduction pathways that mediate the thermal energy transfer without requiring direct mechanical bonding through solder joints or thermal interface materials, thus eliminating the stress and fatigue issues associated with those traditional connection methods.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If thermal straps are bonded to the device and fastened to the ringframe, then thermal energy is effectively transferred from the device to the ringframe, but the structural complexity of the thermal spreader increases

Engineering Contradiction:

Improvethermal energy transfer efficiencyVSAvoidstructural complexity of thermal spreader

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermal straps are designed to perform multiple functions simultaneously: they provide thermal conduction pathways, serve as mechanical mounting elements, and act as structural support components within the ringframe. This multi-functionality reduces the need for separate dedicated components for each function, thereby managing structural complexity while achieving effective thermal energy transfer from the device to the ringframe.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If multiple thermal straps are used to remove thermal energy from multiple directions, then thermal management effectiveness is improved, but the device complexity and number of components increase

Engineering Contradiction:

Improvethermal energy removal effectivenessVSAvoidnumber of thermal straps and components

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

Multiple thermal straps are merged into a unified ringframe structure where the straps are integrated with and supported by the ringframe. This merging approach allows multiple thermal conduction pathways to work together synergistically while sharing common structural support, reducing the overall component count and simplifying the assembly process compared to having completely separate thermal management components.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermal spreader provides improved thermal management by effectively removing thermal energy from semiconductor devices in environments where convection is limited, reducing stress on solder bonds, and allowing for scalable and reliable thermal dissipation.

Implementation Method 1

The pair of thermal straps is configured to be bonded to the device and to be fastened to the ringframe in order to provide the thermal energy from the device to the ringframe

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12322674B2Thermal spreader including ringframe and thermal straps for thermal dissipation in space and other applications

Publication Date: 2025.06.03 RAYTHEON CO

AI summary

An apparatus includes a thermal spreader configured to remove thermal energy from a device to be cooled. The thermal spreader includes a ringframe having an opening, where the opening is configured to provide access to the device through the ringframe. The thermal spreader also includes a pair of thermal straps configured to fit within the opening. The pair of thermal straps is configured to be bonded to the device and to be fastened to the ringframe in order to provide the thermal energy from the device to the ringframe.