Rinse Liquid Control During Substrate Processing Standby
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Solution Overview
Problem
Existing substrate processing systems face challenges in controlling the supply of rinse liquid during standby periods, leading to potential drying or corrosion of substrates, and affecting yield due to fluctuations in rinse liquid amounts.
Innovation Solution
A substrate processing apparatus with controlled rinse liquid supply mechanisms and a control part that manages the supply amount per unit time, standby time, and valve operation to keep the rinse liquid within a target range, preventing drying and corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If rinse liquid is continuously supplied to the substrate during standby time, then the substrate surface is prevented from drying, but the supply amount of rinse liquid exceeds the target range causing waste and potential corrosion
Solution Approach 1:
The rinse liquid supply mechanism switches between supply and non-supply states in periodic cycles. The control part calculates optimal supply time and non-supply time based on standby time t0, creating a periodic action pattern that prevents continuous supply while ensuring the substrate does not dry out. This resolves the contradiction by providing intermittent moisture rather than continuous liquid supply.
Solution Approach 2:
The system dynamically adjusts the rinse liquid supply amount and supply time based on the standby time t0 and target supply amount range. The control part calculates real-time parameters to keep the cumulative supply amount within Lmin to Lmax, making the system adaptive rather than static. This dynamic control prevents both over-supply and under-supply conditions.
2Object-affected harmful factors
If the supply amount of rinse liquid is increased to prevent substrate drying, then the substrate surface remains wet, but the excessive supply amount causes corrosion and yield fluctuations
Solution Approach 1:
The control part continuously monitors the cumulative supply amount of rinse liquid and compares it against the target range (Lmin to Lmax). Based on this feedback, the system adjusts the supply time and non-supply time cycles to keep the supply amount within acceptable limits. This feedback mechanism ensures consistent substrate quality by preventing both drying and over-wetting conditions that cause corrosion.
3Manufacturing precision
If the rinse liquid supply time is extended to ensure adequate coverage, then the substrate is well-rinsed, but the total supply amount exceeds the target range increasing cost and waste
Solution Approach 1:
The system changes the parameters of supply time and non-supply time while maintaining the cumulative supply amount within the target range. By adjusting these temporal parameters rather than simply reducing flow rate, the system ensures adequate coverage during supply periods while limiting total consumption. The control part calculates optimal parameter values based on standby time and target supply amount.
Data Source
AI summary
To appropriately control the supply amount of a rinse liquid, or to calculate the supply amount of the rinse liquid.A substrate processing apparatus includes: a first processing unit which processes a substrate; a second processing unit which processes the substrate after being processed by the first processing unit; a rinse liquid supply mechanism which supplies a rinse liquid to the substrate in standby after being processed by the first processing unit and before being processed by the second processing unit; and a control part which controls at least one of a supply amount per unit time of the rinse liquid, time for supplying the rinse liquid, and standby time until the substrate is transported to the second processing unit, so that a supply amount of the rinse liquid supplied from the rinse liquid supply mechanism to the substrate is within a target range.