Reconfigurable Surface Electrode Layout for RIS Phase Redirection
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Solution Overview
Problem
Existing technologies face challenges in effectively redirecting electromagnetic waves to address communication blind spots using reconfigurable intelligent surfaces (RIS).
Innovation Solution
A reconfigurable surface is designed with a first substrate, modulating units comprising first and second electrodes, and a modulating medium, along with a ground signal layer, to modulate electromagnetic wave phases, enhancing redirection capabilities through optimized electrode arrangements and reduced thickness of the modulating medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If the thickness of the modulating medium is reduced to minimize material usage and cost, then the adjustable amplitude of electromagnetic wave phases decreases, but reducing thickness is necessary to lower production costs
Solution Approach 1:
The patent employs a composite structure consisting of multiple modulating units arranged in an array, where each unit contains electrodes and modulating medium. This composite approach allows the system to achieve sufficient phase modulation capability with reduced thickness of individual modulating medium layers, thereby lowering material usage while maintaining functional performance
Solution Approach 2:
The modulating medium is divided into multiple discrete modulating units that can be independently controlled. By segmenting the modulating medium into an array of units with electrodes, the patent achieves effective phase modulation across the surface without requiring a thick continuous layer, thus reducing overall material consumption while preserving adaptability
2Ease of manufacture
If the thickness of the modulating medium is minimized to reduce production costs, then manufacturing complexity decreases, but the effectiveness of electromagnetic wave redirection may be compromised
Solution Approach 1:
The patent transitions from relying on thickness (one dimension) to utilizing lateral arrangement and electrode configuration (two-dimensional array). By organizing modulating units in an array with properly configured electrodes, the system achieves effective electromagnetic wave redirection without requiring thick modulating medium, thus reducing production costs while maintaining reliability
Solution Approach 2:
The patent optimizes parameters such as electrode spacing, electrode geometry, and modulating unit arrangement to compensate for reduced modulating medium thickness. By carefully adjusting these parameters, the system maintains effective phase modulation capability with thinner materials, achieving cost reduction without sacrificing redirection effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the adjustable amplitude of electromagnetic wave phases, allowing for more effective redirection and reducing production costs by minimizing the thickness and material usage of the modulating medium.
Implementation Method 1
One of the modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode.
Data Source
AI summary
Disclosed is a reconfigurable surface configured to modulate a phase of an electromagnetic wave. The reconfigurable surface includes a first substrate, a plurality of modulating units, and a ground signal layer. The plurality of modulating units are disposed on the first substrate. One of the plurality of modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode. The ground signal layer is disposed under the first substrate. A manufacturing method of a reconfigurable surface is also provided.


