Riser Card Baffle for Server Thermal Management

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Information handling systems face challenges in cooling high-heat generating components due to limited space and air flow constraints, where components downstream from heat-generating components receive inadequate cooling air, leading to inefficient thermal management and increased part count.

Innovation Solution

Integration of a baffle within the riser card cage to divert hotter air away from the riser card cage and channel cooler air from memory devices, improving air flow distribution and reducing space constraints for cable routing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If components are arranged downstream from heat-generating components, then space utilization is improved, but cooling efficiency deteriorates due to inadequate cooling air reaching downstream components

Engineering Contradiction:
Improvespace utilizationVSAvoidcooling efficiency
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The riser card cage is segmented into multiple zones with dedicated air flow channels. Cooler air from memory devices is channeled through specific pathways to reach downstream components, while hotter air from processors is directed through separate exhaust pathways. This segmentation allows downstream components to receive adequate cooling air despite being positioned in space-constrained areas.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A baffle structure is introduced as an intermediary element within the riser card cage. This baffle redirects and channels cooler air from memory devices toward downstream components, acting as a mediator that improves air flow distribution without requiring changes to the overall compact layout or additional external cooling components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If traditional separate cooling and cable routing structures are used, then functional requirements are met, but part count increases and space is wasted

Engineering Contradiction:
Improvefunctional requirementsVSAvoidpart count
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The cooling structure and cable routing structure are merged into a single integrated riser card cage assembly. The cage simultaneously performs thermal management functions by channeling cooler air from memory devices to downstream components and provides cable routing pathways along its structure. This consolidation eliminates the need for separate cooling ducts and cable management components, reducing part count while maintaining all required functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The riser card cage is designed as a multi-functional component that combines structural support, cooling air flow channeling, and cable routing capabilities. By making the cage universal and multi-functional, the design eliminates redundant parts and reduces overall system complexity while ensuring all functional requirements are met.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances cooling efficiency by ensuring all components receive adequate cooler air, reduces part count, and optimizes space usage within the system, improving thermal management and manufacturing efficiency.

Implementation Method 1

The baffle may be configured to divert a first air flow from the processor away from the riser card cage

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

The baffle may be configured to channel a second air flow from the memory device into the riser card cage

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11294433B2System and method for integrated thermal and cable routing for server rear modules
Publication Date: 2022.04.05 DELL PROD LP
  • US11294433B2 patent drawing
  • US11294433B2 patent drawing
  • US11294433B2 patent drawing

AI summary

An information processing system includes a processor, a memory device, and riser card. The riser card includes a riser card cage, a circuit card, and a baffle. The circuit card is installed into the riser card cage and includes a card edge and a connector affixed to the circuit card. The card edge is configured to be installed into another connector on an information handling system in a first orientation. The connector is configured to receive a card edge of an add-in card in a second orientation perpendicular to the first orientation. The baffle is integrated with the riser card cage. The baffle is configured to divert a first air flow from the processor away from the riser card cage, and to channel a second air flow from the memory device into the riser card cage.