Riveted Edge Glass Core for Delamination-Resistant Packaging
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Solution Overview
Problem
The integration of a glass layer in semiconductor package architectures introduces manufacturing challenges such as delamination of mold or dielectric material due to temperature or mechanical stresses, reducing yield and making it difficult to make substrate components fungible with existing organic substrate components.
Innovation Solution
The implementation of a riveted edge glass core with a mold or dielectric material in the glass layer, which improves adhesion and allows for reconstitution into a planar area compatible with existing manufacturing processes, using a glass core with riveted edges that enhance the bonding of the mold or dielectric material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a layer of glass is used in semiconductor package architecture to improve dimensional stability, then the dimensional stability and ability to place more die on substrate are improved, but delamination of mold or dielectric material occurs due to temperature or mechanical stresses
Solution Approach 1:
The patent applies preliminary action by forming recesses in the glass layer before applying the mold or dielectric material. These recesses are created in advance to accommodate thermal expansion and mechanical stress, preventing delamination before it occurs during subsequent manufacturing processes or operational conditions.
Solution Approach 2:
The patent implements local quality by creating localized recesses only at specific edges or corners of the glass layer where stress concentration is most likely to occur. This targeted approach provides adhesion relief exactly where needed, rather than modifying the entire glass layer uniformly.
2Productivity
If a layer of glass is used to enable more complex die placement, then the substrate capacity is improved, but the manufacturing process becomes more difficult and yield is reduced
Solution Approach 1:
The recesses are formed in the glass layer before die attachment and molding operations, allowing subsequent manufacturing steps to proceed without modification. This preliminary structuring simplifies the overall manufacturing process by pre-solving the adhesion problem that would otherwise complicate later stages.
Solution Approach 2:
The patent changes the physical parameters of the glass layer by creating controlled void spaces (recesses) that alter the mechanical and thermal properties at the interface. This parameter modification enables the glass layer to accommodate stress without delamination, maintaining manufacturing feasibility.
3Strength
If a layer of glass is used to improve substrate stability, then the structural integrity is improved, but delamination occurs reducing manufacturing yield
Solution Approach 1:
By pre-forming recesses in the glass layer before assembly, the patent eliminates the root cause of delamination that would lead to yield loss. This preliminary structural modification ensures reliable bonding throughout the manufacturing process and product lifecycle.
Solution Approach 2:
The recesses are strategically placed at specific locations on the glass layer where stress concentration would most likely cause delamination. This localized intervention maintains overall structural integrity while preventing failure at critical points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances adhesion between the glass layer and exterior matrix material, reducing delamination and improving yield by making the glass layer fungible with existing organic substrate components during manufacturing.
Implementation Method 1
a layer of glass or glass core to improve the dimensional stability of the substrate package
Implementation Method 2
The practice of embodiments can be identified in individual substrate packages, microelectronic assemblies and final products, as well as in reconstituted wafers, sub-panels, and panels. Embodiments improve the adhesion between the layer of glass and the exterior matrix material
Data Source
AI summary
Architectures and process flows for a riveted edge core component for semiconductor packaging. The core component includes a glass core defined by a planar area enclosed by one or more edges that are substantially orthogonal to the planar area and at least one through-glass via (TGV) in the layer of glass, substantially filled with a conductive material. The core component has a cavity extending laterally within at least one of the one or more edges. A dielectric material is in the cavity. The cavity is defined by a first sidewall extending at a first angle from an edge of the layer of glass towards a center point, and a second sidewall extending at a second angle from the edge of the layer of glass towards the center point. The first angle and the second angle are less than 45 degrees.