Riveted Flooring Panel Sample Module to Prevent Bond Separation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Flooring panel samples in retail displays face issues with glue degradation due to plasticizer migration, leading to separation from backer boards, posing safety risks and increasing waste and replacement costs.

Innovation Solution

A flooring panel sample module constructed with peripheral trim, adhesive, backer board, and rivets, eliminating the need for glue by securing the panel to the backer board through rivets, thereby enhancing construction integrity and safety.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If glue is used to bond the flooring panel sample to the backer board, then initial bonding is achieved, but the bond strength degrades over time due to plasticizer migration

Engineering Contradiction:
Improvebond strengthVSAvoidbond durability
Core Design Contradiction:
StrengthVSDuration of action of stationary object

Solution Approach 1:

The patent removes the problematic glue component from the bonding system and replaces it with rivets. This extraction of the harmful element (glue subject to plasticizer migration) eliminates the root cause of bond degradation while maintaining the essential function of bonding the panel to the backer board.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the chemical bonding mechanism (glue) with a mechanical fastening system (rivets). This substitution transitions from a chemical bond that degrades over time to a mechanical connection that maintains its strength, resolving the durability issue while preserving initial bonding capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If glue is used to attach the flooring panel sample to the backer board, then bonding is achieved, but separation occurs over time posing safety risks

Engineering Contradiction:
Improvesample integrityVSAvoidsafety hazards from separation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

By removing glue from the system and replacing it with rivets, the patent eliminates the source of bond failure that leads to sample separation. This extraction prevents the harmful outcome (safety hazards) while maintaining sample integrity throughout the product lifecycle.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The rivet system provides preemptive reinforcement against bond failure. Rather than relying on glue that may degrade, the mechanical fasteners are installed beforehand to prevent separation, cushioning against the potential harm of sample detachment and associated safety risks.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If glue is used for bonding, then initial assembly is simple, but long-term bonding reliability deteriorates

Engineering Contradiction:
Improveassembly simplicityVSAvoidlong-term bond reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces the glue application process with a rivet fastening system. While rivet installation may require additional steps compared to simple glue application, it eliminates the long-term reliability issues associated with glue degradation, achieving a balance between manufacturing complexity and sustained bonding performance.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module provides stable bonding without relying on glue, reducing injury risks, increasing sample availability, and minimizing waste by preventing separation, thus improving retail display efficiency.

Implementation Method 1

adhesive disposed on a bottom surface of the peripheral trim, a backer board adhered to the adhesive

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS12609054B2Flooring panel sample module and method of manufacture
Publication Date: 2026.04.21 SHAW IND GROUP INC
  • US12609054B2 patent drawing
  • US12609054B2 patent drawing
  • US12609054B2 patent drawing

AI summary

A flooring panel sample module and method of manufacturing the same. The module provides superior construction integrity without relying on the unpredictable performance of glue.