Power Semiconductor Module Riveted Substrate Carrier
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Solution Overview
Problem
Existing power semiconductor modules require complex and costly manufacturing processes due to the combination of adhesive and riveted connections between the substrate carrier and housing.
Innovation Solution
A power semiconductor module design featuring a substrate carrier with a continuous cutout and a housing extension that forms a riveted connection through deformation, allowing for a simpler and cost-effective production method, where the extension projects beyond the substrate carrier and is deformed to widen and form a secure rivet connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate carrier is connected to the housing by both adhesive bond and riveted connection, then the connection security is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts and eliminates the adhesive bonding step from the traditional dual-connection method. Instead of using both adhesive bond and riveted connection, the patent employs only a riveted connection through the substrate carrier, simplifying the manufacturing process while maintaining secure attachment between the substrate carrier and housing
Solution Approach 2:
The invention changes the geometric parameters of the substrate carrier by introducing a continuous cutout with specific width variations (narrower on the inner main surface, wider on the outer main surface). This parameter change enables the riveted connection to provide both mechanical strength and sealing function, replacing the need for adhesive bonding
2Ease of manufacture
If the substrate carrier uses a continuous cutout with varying width for riveted connection, then the ease of manufacture is improved, but the sealing performance against liquid insulating material must be maintained
Solution Approach 1:
The invention applies asymmetry to the cutout geometry in the substrate carrier. The cutout has different widths at different locations: narrower on the inner main surface (facing the interior) and wider on the outer main surface (facing the exterior). This asymmetric design allows the riveted connection to achieve both easy manufacture and effective sealing against liquid insulating material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a strong, automatable connection between the housing and substrate carrier, enabling efficient heat dissipation and secure attachment to cooling components while simplifying the manufacturing process and preventing potting compound leakage.
Implementation Method 1
deforming the end of the at least one extension in such a way that its end widens as a result, thereby forming a rivet connection
Implementation Method 2
effective spreading of the heat for dissipating heat from the power-electronics circuit arrangement to a cooling component
Data Source
AI summary
A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner surface (facing the interior of the module) and its outer surface. The cutout is smaller at the inner surface than at the outer surface. The housing has an extension that reaches into the cutout and may be deformed to form a riveted connection. The method comprises: forming a housing with at least one extension which extends towards the exterior of the module, wherein the extension projects through the cutout and beyond the outer surface of the carrier; and deforming the end of the extension so that it widens and forms a riveted connection and at the same time lies below the outer surface of the carrier.