Reactive Multilayer System for Radiation Detector Thermal Management

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Solution Overview

Problem

Radiation detectors face challenges in effectively dissipating heat, particularly from the converter materials and evaluation units, which can lead to thermal damage and inefficient cooling processes.

Innovation Solution

The implementation of a reactive multilayer system (RMS) between the sensor component and the heat dissipation component, which undergoes a self-propagating exothermic reaction upon activation, creating a strong thermal connection without exposing temperature-sensitive materials to high temperatures, allowing for rapid and localized heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal bonding is used to attach the heat sink to the sensor component, then heat dissipation is enabled, but the sensor component is exposed to high temperatures during the bonding process

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidthermal damage to sensor component
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

A reactive multilayer system is introduced as an intermediary between the heat sink and the sensor component. This RMS consists of multiple thin layers alternating between reactive materials (e.g., aluminum, titanium, nickel) and solder materials. When activated, the RMS undergoes a self-propagating exothermic reaction that creates a strong thermal connection without requiring high external temperatures, thus protecting the temperature-sensitive sensor component while enabling effective heat dissipation to the heat sink.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding process utilizes a change in the physical and chemical state of the reactive multilayer system. By applying a small external energy input (heat, pressure, or electrical pulse), the RMS transitions from a stable state to an actively reacting state, where the exothermic reaction releases heat that facilitates the formation of a strong thermal bond. This parameter change allows the bonding to occur at lower external temperatures than conventional thermal bonding methods.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If conventional thermal bonding is used, then heat dissipation is achieved, but the bonding process is time-consuming and less efficient

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidbonding process duration
Core Design Contradiction:
TemperatureVSLoss of time

Solution Approach 1:

The reactive multilayer system performs the bonding process autonomously through a self-propagating exothermic reaction. Once activated by a small external energy input, the RMS automatically reacts with itself, releasing heat that drives the bonding process without requiring continuous external heating or complex bonding equipment. This self-service mechanism significantly reduces bonding time and increases efficiency compared to conventional thermal bonding methods.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The bonding process exploits phase transitions and chemical reactions within the reactive multilayer system. The exothermic reaction transforms chemical energy into thermal energy, creating a localized heat source that accelerates the bonding process. This phase transition from chemical to thermal energy enables rapid bonding without prolonged external heating, thereby reducing the overall bonding time and improving efficiency.

Inventive Principle:
Principle #36Phase transitions

3Temperature

If the heat sink is attached directly to the sensor component, then heat dissipation is simplified, but the thermal connection strength is insufficient

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidthermal connection strength
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The reactive multilayer system functions as a composite material structure, combining multiple thin layers of reactive materials (aluminum, titanium, nickel) and solder materials in an alternating arrangement. This composite structure provides both the mechanical strength needed for a robust bond and the thermal properties required for efficient heat dissipation. The layered composition creates a strong thermal connection between the heat sink and sensor component that surpasses direct attachment methods.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables effective heat dissipation, preventing thermal damage to sensitive components and allowing for rapid cooling, thereby improving the reliability and performance of radiation detectors.

Implementation Method 1

The reactive multilayer system (RMS) undergoes a self-propagating exothermic reaction upon activation, creating a strong thermal connection

Methodology Applied
Scientific EffectExothermic reaction: Exothermic Reaction

Implementation Method 2

creating a strong thermal connection between the sensor component and the heat dissipation component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240125949A1Method for manufacturing a radiation detector module and radiation detector module
Publication Date: 2024.04.18 SIEMENS HEALTHINEERS AG
  • US20240125949A1 patent drawing
  • US20240125949A1 patent drawing
  • US20240125949A1 patent drawing

AI summary

A method for manufacturing a radiation detector module including a sensor component and a heat dissipation component includes arranging a reactive multilayer system between the sensor component and the heat dissipation component. The sensor component and the heat dissipation component are brought together. The reactive multilayer system is activated for creating an RMS connection between the sensor component and the heat dissipation component. A radiation detector module manufactured with this method, as well as a radiation detector with such radiation detector modules and an imaging system, and also a replacement part for a radiation detector module are also provided.