Robot Blade Boot for Wafer Cassette Calibration Precision

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Solution Overview

Problem

The existing methods for calibrating wafer handling robots and wafer cassettes are time-consuming and prone to human error, leading to inaccurate alignment and potential damage to semiconductor wafers due to subjective observation and parallax effects during the calibration process.

Innovation Solution

A detachable robot blade boot with increased thickness and improved visibility is affixed to the robot blade, reducing tolerance and subjectivity in the calibration process by providing a clearer visual indication of proper centering between wafers, thus enhancing precision and minimizing the risk of wafer damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If manual calibration is performed without calibration tools, then the calibration process can be completed, but human error and subjectivity increase leading to reduced measurement precision

Engineering Contradiction:
Improvecalibration precisionVSAvoidcalibration tool complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

A calibration tool is introduced as an intermediary device between the robot blade and the wafers. This tool provides visual indicators (colored surfaces) that mediate the alignment process, allowing the technician to objectively determine when the blade is properly centered between wafers, thereby eliminating subjective visual estimation and parallax errors.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The calibration tool incorporates colored surfaces (first colored surface and second colored surface) that change or differ in appearance based on their orientation and position. When the robot blade is properly centered between wafers, the colored surfaces display specific visual patterns that provide an unambiguous indication of correct alignment, replacing subjective visual judgment with objective color-based feedback.

Inventive Principle:
Principle #32Color changes

2Manufacturing precision

If the robot blade is made thinner to reduce tolerance, then precision between wafers improves, but visibility and ease of observation deteriorate

Engineering Contradiction:
Improveblade centering precisionVSAvoidblade position visibility
Core Design Contradiction:
Manufacturing precisionVSDifficulty of detecting and measuring

Solution Approach 1:

The calibration tool serves as a mediator that amplifies the visual signal for blade positioning. Instead of directly observing the thin blade's position, the technician observes the calibration tool's colored surfaces, which provide enhanced visual feedback about the blade's relative position between wafers, making the measurement process easier and more accurate.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The calibration tool uses colored surfaces to provide high-contrast visual indicators of blade position. The colors make it easier to detect and measure the blade's centering status, overcoming the visibility limitations of a thin blade while maintaining the precision required for accurate alignment.

Inventive Principle:
Principle #32Color changes

3Measurement precision

If calibration is performed frequently to maintain accuracy, then measurement precision is maintained, but loss of time increases

Engineering Contradiction:
Improvealignment accuracyVSAvoidcalibration time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The calibration tool is designed to be self-aligning and self-indicating. When the robot blade is moved between wafers, the calibration tool automatically displays visual indicators that show whether centering is correct, eliminating the need for complex measurement procedures or multiple adjustment iterations. This self-service capability reduces calibration time while maintaining precision.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The calibration tool provides immediate visual feedback through its colored surfaces about the blade's positioning accuracy. This real-time feedback allows technicians to quickly determine if adjustment is needed and by how much, significantly reducing the time required to achieve proper alignment compared to methods requiring iterative measurement and adjustment.

Inventive Principle:
Principle #23Feedback

4Measurement precision

If expert technicians perform calibration, then measurement precision improves, but ease of operation deteriorates due to specialized skill requirements

Engineering Contradiction:
Improvecalibration accuracyVSAvoidcalibration operation ease
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The calibration tool is designed to guide the technician through the calibration process automatically. The visual indicators on the colored surfaces provide intuitive feedback that does not require specialized knowledge to interpret, allowing technicians with varying skill levels to perform accurate calibration. The tool essentially performs part of the calibration function itself through its self-indicating mechanism.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The use of colored surfaces provides universal visual language that is easy to understand regardless of the technician's expertise level. The color patterns and transitions offer intuitive cues about positioning accuracy, eliminating the need for specialized training or complex interpretation skills, thereby improving ease of operation while maintaining precision.

Inventive Principle:
Principle #32Color changes

Data Source

PatentUS7933685B1System and method for calibrating a wafer handling robot and a wafer cassette
Publication Date: 2011.04.26 NAT SEMICON CORP
  • US7933685B1 patent drawing
  • US7933685B1 patent drawing
  • US7933685B1 patent drawing

AI summary

A system and method is disclosed for calibrating a semiconductor wafer handling robot and a semiconductor wafer cassette. A robot blade boot is attached to a robot blade of the semiconductor handling robot. The robot blade boot decreases a value of tolerance for the robot blade to move between two semiconductor wafers in the semiconductor wafer cassette. In one embodiment the vertical tolerance is decreased to approximately twenty thousandths of an inch (0.020″) on a top and a bottom of the robot blade boot. The use of the robot blade boot makes the calibration steps more critical and precise. The robot blade boot is removed from the robot blade after the calibration process has been completed.