Robot Blade With Segmented Contact Points for Wafer Handling

Solution Overview

Problem

Wafer transfer robots cause damage to substrates with patterns on both sides due to contact, and existing solutions that avoid backside contact result in warpage of thin substrates during handling.

Innovation Solution

A wafer transfer robot with a robot blade featuring spatially distinct contact points along the perimeter of a wafer reception area, separated by a cavity, which supports the substrate without contacting its backside, preventing warpage and damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the robot blade contacts the backside of the substrate to prevent warpage, then substrate stability is improved, but substrates with patterns on both sides suffer damage

Engineering Contradiction:

Improvesubstrate stabilityVSAvoidsubstrate damage

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The robot blade is segmented into multiple contact points rather than a continuous contact surface. The contact points are positioned at specific locations (e.g., corners or edges) that provide structural support without contacting the patterned backside of the substrate, thus preventing both warpage and damage to sensitive patterns.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The contact points are strategically positioned at specific locations on the substrate (such as corners or edges) where support is needed but pattern contact is avoided. This localized contact approach provides stability while preserving the integrity of patterned areas on the substrate backside.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the robot blade avoids contacting the backside of the substrate, then substrate damage is reduced, but thin substrates experience warpage during handling

Engineering Contradiction:

Improvesubstrate damageVSAvoidsubstrate stability

Core Design Contradiction:

Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The robot blade is segmented into multiple contact points rather than a continuous contact surface. The contact points are positioned at specific locations (e.g., corners or edges) that provide structural support without contacting the patterned backside of the substrate, thus preventing both warpage and damage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The contact points are positioned at the perimeter or corners of the substrate, utilizing the dimensional arrangement of points rather than a continuous surface. This dimensional change allows support to be provided at critical locations without creating the harmful effect of broad backside contact.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Stability of the object's composition

If continuous contact surface is used on the robot blade, then substrate support is maximized, but contact with patterned substrates causes damage

Engineering Contradiction:

Improvesubstrate supportVSAvoidpattern damage

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The robot blade is segmented into multiple contact points rather than a continuous contact surface. The contact points are positioned at specific locations (e.g., corners or edges) that provide structural support without contacting the patterned backside of the substrate, thus preventing both warpage and damage to sensitive patterns.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The contact points are strategically positioned at specific locations on the substrate (such as corners or edges) where support is needed but pattern contact is avoided. This localized contact approach provides stability while preserving the integrity of patterned areas on the substrate backside.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS9434076B2Robot blade design

Publication Date: 2016.09.06 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The present disclosure relates to a wafer transfer robot having a robot blade that can be used to handle substrates that are patterned on both sides without causing warpage of the substrates. In some embodiments, the wafer transfer robot has a robot blade coupled to a transfer arm that varies a position of the robot blade. The robot blade has a wafer reception area that receives a substrate. Two or more spatially distinct contact points are located at positions along a perimeter of the wafer reception area that provide support to opposing edges of the substrate. The two or more contact points are separated by a cavity in the robot blade. The cavity mitigates contact between a backside of the substrate and the robot blade, while providing support to opposing sides of the substrate to prevent warpage of the substrate.