Robot Bumper Sensor Array Design to Reduce Mechanical Complexity

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Solution Overview

Problem

Existing robot bumper assemblies are complex, prone to mechanical failure, and limited in detecting impact location and force due to rigid designs with multiple moving parts, which also create visual seams and dust collection issues.

Innovation Solution

A robot bumper assembly with multiple sensor arrays positioned along the periphery of the bumper body, including a membrane switch assembly with conductive layers and a separation layer, allowing for precise detection of impact location and force without mechanical complexity, and capable of detecting impacts from various directions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If rigid bumper with springs and pivots is used, then impact energy can be absorbed, but mechanical complexity increases and reliability decreases

Engineering Contradiction:
Improveimpact energy absorptionVSAvoidmechanical mounting complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical spring-pivot bumper system with a flexible circuit board containing sensor arrays. The flexible circuit board can deflect under impact forces while maintaining electrical connectivity, eliminating the need for mechanical springs, pivots, and associated mounting hardware. This substitution reduces mechanical complexity while preserving impact detection capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs a flexible circuit board as the bumper structure, which can bend and deflect under impact forces. This thin, flexible membrane provides both structural compliance for impact absorption and integrated sensing capability, replacing rigid mechanical components with a flexible sensing medium.

Inventive Principle:
Principle #30Flexible shells and thin films

2Measurement precision

If multiple switches and suspension points are used, then impact detection zones increase, but device complexity increases

Engineering Contradiction:
Improveimpact location detection precisionVSAvoidnumber of switches and suspension points
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the bumper surface into multiple sensing zones by placing sensor arrays at different locations on the flexible circuit board. Each sensor array can independently detect impacts in its specific zone, providing precise location information without requiring complex mechanical segmentation or multiple suspension points.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flexible circuit board serves multiple functions simultaneously: it provides the structural bumper element, acts as the suspension system through its flexibility, and contains the sensor arrays for impact detection. This multi-functionality eliminates the need for separate mechanical components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If bumper is spaced away from robot chassis, then impact detection is enabled, but dust and debris collection increases

Engineering Contradiction:
Improveimpact detection capabilityVSAvoiddust and debris collection
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The flexible circuit board bumper can be positioned close to or in contact with the robot chassis while maintaining sensing capability. Its flexibility allows it to deflect under impact forces regardless of its proximity to the chassis, eliminating the need for spacing that would create dust-trapping gaps.

Inventive Principle:
Principle #30Flexible shells and thin films

4Device complexity

If carbon puck bumper structure is used, then mechanical complexity is reduced, but weight increases and manufacturing cost increases

Engineering Contradiction:
Improvemechanical mounting simplicityVSAvoidbumper weight
Core Design Contradiction:
Device complexityVSWeight of moving object

Solution Approach 1:

The flexible circuit board bumper is a thin, lightweight membrane that can be directly mounted to the robot chassis. It provides both structural function and sensing capability without the weight penalty of carbon puck materials or complex mechanical mounting structures.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides reliable and robust impact detection with a virtually unlimited number of zones, eliminating mechanical mounting issues and visual seams, while being aesthetically pleasing and efficient in space usage.

Implementation Method 1

The first and second sensor arrays may be pressure sensitive

Methodology Applied
Scientific EffectPressure-sensitive membrane switch detection:

Data Source

PatentEP2825925B1Bumper for robot comprising sensor arrays
Publication Date: 2022.04.27 IROBOT CORP
  • EP2825925B1 patent drawingFigure 1A
  • EP2825925B1 patent drawingFigure 1B
  • EP2825925B1 patent drawingFigure 1C

AI summary

A robot bumper assembly (108) includes a bumper body (107), a first sensor array (120a) and a second sensor array (120b). The first sensor array is disposed along and contoured to the periphery of a forward facing portion (110) of the bumper body and senses contact with an external environment at positions along the contour of the periphery forward facing portion of the bumper body. The second sensor array is disposed along and contoured to the periphery of a top portion (109) of the forward facing portion of the robot body. The top portion is angled, ramping up. The second sensor array senses contact with an external environment at positions along the periphery of the angled top portion of the bumper body.