Robot Hand Unit With Adjustable Support Heights For Wafer Transfer
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Solution Overview
Problem
Existing semiconductor wafer transfer systems face challenges in maintaining wafer quality due to dust adherence from hand units, and current solutions involving twin-arm transfer apparatuses are costly and complex.
Innovation Solution
A hand unit for a robot arm with a U-shaped placement portion featuring multiple support portions that can change support heights, allowing the semiconductor wafer to be transferred at different heights using a single hand unit, preventing dust adherence by adjusting support positions before and after processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single hand unit is used to transfer semiconductor wafers before and after a cleaning process, then device complexity is reduced and cost decreases, but dust remaining in the hand unit adheres to the semiconductor wafer after the process
Solution Approach 1:
The hand unit employs movable support portions that can dynamically adjust their positions in the vertical direction. The support portions include driving units that enable them to move between a first support position (higher) and a second support position (lower), allowing the hand unit to adapt its configuration based on whether the wafer is being transferred before or after cleaning, thus preventing dust adherence while maintaining a single hand unit structure
Solution Approach 2:
The invention changes the vertical position parameter of the support portions to differentiate between pre-cleaning and post-cleaning transfer operations. By adjusting the support height parameter, the hand unit creates sufficient vertical clearance to prevent dust particles from adhering to the wafer surface after cleaning, while still using the same hand unit for both operations
2Adaptability or versatility
If inclined support is used to change wafer orientation, then support position can be changed, but particles curl up from the placement table and adhere to the semiconductor wafer
Solution Approach 1:
Instead of using fixed inclined support, the invention employs dynamically adjustable support portions that can change their vertical position. The support portions move in the vertical direction to adjust wafer height, maintaining horizontal wafer orientation throughout transfer while preventing particle curl-up, thereby combining adaptability with contamination prevention
Solution Approach 2:
The hand unit proactively prevents particle adherence by maintaining the wafer in horizontal orientation during transfer. By keeping the wafer surface parallel to the placement table and avoiding inclined positioning, the invention preemptively prevents particles from curling up and adhering to the wafer, rather than attempting to remove particles after they have adhered
3Object-affected harmful factors
If twin-arm transfer apparatus is used to switch hand units, then dust adherence is prevented, but structure and operation control become complicated and cost increases
Solution Approach 1:
The hand unit is designed with multi-functional capability, serving both pre-cleaning and post-cleaning transfer operations. By equipping a single hand unit with movable support portions that can adjust their vertical positions, the invention eliminates the need for separate hand units for different transfer stages, thereby reducing operational complexity while preventing dust adherence
Solution Approach 2:
The dynamic adjustability of the support portions within a single hand unit replaces the need for multiple static hand units. The ability of the support portions to move between different vertical positions enables one hand unit to perform the functions previously requiring two separate hand units, simplifying operation control while maintaining contamination prevention
Data Source
AI summary
A hand unit of a robot arm includes a U-shaped placement portion on which a semiconductor wafer is placed. The hand unit includes, on one end side of the placement portion, a first support portion configured to support the semiconductor wafer at a first support height and a second support portion configured to support the semiconductor wafer at a second support height, and includes, on the other end side of the placement portion, a third support portion configured to support the semiconductor wafer at the first support height and a fourth support portion configured to support the semiconductor wafer at the second support height. The hand unit further includes a first driving unit configured to move the third support portion and/or the fourth support portion forward and backward with respect to the first support portion and the second support portion.