Robot Integrated Aligner Wafer Orientation

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Solution Overview

Problem

Semiconductor wafers often require precise orientation for processing in different semiconductor process chambers, leading to inefficiencies in wafer handling and processing time due to the need for separate wafer alignment chambers.

Innovation Solution

A robot with an integrated wafer aligner, featuring a base, rotatable wafer support, and multi-link robotic arms, which can align and rotate wafers while moving between process chambers, reducing non-processing time and increasing throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a separate wafer alignment chamber is used, then wafer orientation can be adjusted, but processing time increases and throughput decreases

Engineering Contradiction:
Improvewafer orientation precisionVSAvoidprocessing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent combines the wafer alignment function with the robotic wafer transfer mechanism by integrating a rotatable wafer support directly onto the robotic arm. This allows the alignment operation to be performed during the transfer process itself, eliminating the need for a separate alignment chamber and thereby increasing throughput while maintaining orientation precision.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The wafer orientation is adjusted preliminarily during the transfer process before the wafer reaches the destination chamber. The robotic arm with integrated rotatable support performs both transfer and alignment in one continuous motion, preparing the wafer in the correct orientation before processing begins, thus eliminating post-transfer alignment steps.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If wafer alignment is performed separately, then orientation precision can be maintained, but non-processing time increases

Engineering Contradiction:
Improvewafer alignment precisionVSAvoidnon-processing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The alignment operation is merged with the transfer operation by integrating the rotatable wafer support onto the robotic arm. This combination allows both functions to be performed simultaneously during a single operational cycle, eliminating dedicated alignment time and reducing overall non-processing time.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The robotic arm performs transfer and alignment in continuous motion without interruption. The wafer support rotates continuously during transfer, maintaining useful action throughout the entire operation and eliminating idle time that would occur with separate alignment steps.

Inventive Principle:
Principle #20Continuity of useful action

3Manufacturing precision

If dedicated alignment chambers are used, then wafer orientation can be controlled, but equipment complexity and space requirements increase

Engineering Contradiction:
Improvewafer orientation controlVSAvoidequipment structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the alignment function into the existing robotic transfer system by adding a rotatable support mechanism to the robotic arm. This integration eliminates the need for separate alignment chambers and reduces overall equipment complexity while maintaining precise orientation control through the integrated mechanism.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The robotic arm is designed with multi-functionality, serving both as a transfer mechanism and an alignment device. The rotatable wafer support enables the same robotic arm to perform both pickup/delivery and orientation adjustment, reducing the need for dedicated alignment equipment and simplifying the overall system architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9299598B2Robot with integrated aligner
Publication Date: 2016.03.29 LAM RES CORP
  • US9299598B2 patent drawing
  • US9299598B2 patent drawing
  • US9299598B2 patent drawing

AI summary

A robot with an integrated aligner is provided that allows for the alignment of a semiconductor wafer while the semiconductor wafer transits between multiple stations. The robot with an integrated aligner may contain a rotational wafer support configured to rotate and/or translate, one or multiple robotic arms, and a sensor. The robot may pick and place the semiconductor wafer with the robotic arm from or into a station and from or onto the rotational wafer support. The robot may be configured to rotate the semiconductor wafer into a desired orientation when the semiconductor wafer is on the rotational wafer support. The rotation of the semiconductor wafer into a desired orientation may be aided the sensor. The robot may have a positioning mechanism which moves it between different positions in a semiconductor tool.