Robot Wafer Transfer Correction Using an Automated Jig Wafer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for correcting robots used in semiconductor wafer transfer processes are prone to operational errors due to manual handling, leading to increased downtime and potential wafer damage.
Innovation Solution
A method involving a correction device with a jig wafer that automatically collects data during robot operations, determines if correction is needed, and applies compensation values to adjust the robot's position accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual handling of correction jig is used, then operator can perform calibration, but operational errors occur and downtime increases
Solution Approach 1:
The correction system performs self-calibration using the correction wafer and sensors integrated into the robot system. The robot automatically moves the correction wafer to reference positions, and sensors automatically detect position deviations, eliminating the need for manual operator intervention and thereby preventing operational errors while maintaining correction accuracy.
Solution Approach 2:
The patent replaces manual mechanical handling of the correction jig with an automated system using the robot arm and electronic sensors. The mechanical operation of placing and reading the correction jig by hand is substituted with automated robot positioning and optical/electronic detection, improving both precision and reliability.
2Measurement precision
If chambers are opened for placing and taking out correction jig, then calibration can be performed, but machine restart work is required and downtime increases
Solution Approach 1:
The correction wafer is pre-loaded into the chamber before the robot correction process begins. The robot and sensors are already in position, and the correction wafer is ready for immediate use. This preliminary preparation eliminates the need to open chambers during the correction process, allowing continuous operation and reducing downtime.
Solution Approach 2:
The correction process is designed to continue without interrupting the chamber sealing or requiring machine restart. The robot operates continuously within the sealed chamber environment, moving the correction wafer and collecting data without breaking the vacuum or atmospheric seal, thereby maintaining continuous productive action.
3Device complexity
If manual correction method is used, then simple equipment is needed, but operational errors lead to wafer damage risk
Solution Approach 1:
The correction wafer serves as an intermediary object that mediates between the robot and the wafer being transferred. By using the correction wafer with known reference positions, the system can detect and correct robot positioning errors without directly testing on actual wafers, thereby eliminating the risk of wafer damage while maintaining system simplicity.
Data Source
AI summary
A method for correcting a robot is provided. The method includes: providing a correction device, wherein the correction device comprises a jig wafer; grabbing and/or transferring the jig wafer by using the robot to obtain collected data; determining, based on the collected data, whether the robot needs to be corrected; and in response to that the robot needs to be corrected, obtaining a compensation value according to the collected data, and correcting the robot based on the compensation value.