Multi-Joint Robot Sheet Sticking Apparatus for Simultaneous Wafer Processing
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Solution Overview
Problem
Existing sheet sticking methods for semiconductor wafers are inefficient as they cannot simultaneously stick sheets to multiple plate-like objects, limiting processing capacity and scalability, especially with the increasing demand for smaller size wafers due to advancements in LED performance.
Innovation Solution
A sheet sticking apparatus with a multi-joint robot and vertically movable tables that allows simultaneous sheet application and cutting across multiple wafers, maintaining constant press force and enabling efficient transfer and inspection, utilizing a multi-functional cutting device with a cutter blade and suction arm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional sheet sticking method using one wafer supported on a table is adopted, then the sheet can be stuck to the wafer, but the sheet cannot be stuck to a plurality of plate-like objects substantially simultaneously, limiting processing capacity
Solution Approach 1:
The table is segmented into a plurality of inner tables that can be arranged in a substantially identical plane, allowing multiple plate-like objects to be supported simultaneously. This segmentation enables parallel processing of multiple wafers, thereby increasing productivity without requiring a completely new apparatus design.
Solution Approach 2:
The table structure is designed to serve multiple functions: it can support multiple plate-like objects simultaneously, accommodate varying thicknesses through vertical movement capability, and work with the press roller to apply uniform pressure. This multi-functionality allows the apparatus to handle diverse processing requirements while maintaining high productivity.
2Adaptability or versatility
If the thickness of plate-like objects or sheet varies, then processing flexibility is improved, but maintaining constant press force becomes difficult
Solution Approach 1:
The inner tables are designed to move vertically in accordance with the thickness of plate-like objects, and the outer table moves vertically in accordance with the thickness of the sheet. This dynamic adjustment capability allows the system to adapt to varying thicknesses while maintaining constant press force through coordinated vertical movement of the tables and press roller.
Solution Approach 2:
The system incorporates feedback mechanisms where the vertical positions of the inner tables and outer table are adjusted based on the measured thickness of plate-like objects and sheet. This feedback control ensures that the press roller applies consistent pressure regardless of thickness variations, maintaining force consistency while handling diverse materials.
3Manufacturing precision
If separate cutting and transferring devices are used, then cutting precision and transfer accuracy are maintained, but device complexity and cost increase
Solution Approach 1:
The cutting device is designed as a multi-joint robot that can perform both cutting operations and transfer operations by selectively mounting a cutter blade or suction arm. This merging of functions into a single device maintains cutting precision and transfer accuracy through controlled robotic movement while reducing the total number of devices required, thereby lowering complexity and cost.
Solution Approach 2:
The multi-joint robot is designed as a universal cutting device that can perform multiple functions: cutting the sheet along the outer periphery of plate-like objects and transferring the plate-like objects to the table. By selectively mounting different tools (cutter blade or suction arm), the single device maintains high precision for both cutting and transfer operations while eliminating the need for separate dedicated devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases processing capacity by allowing simultaneous sheet application to multiple wafers, maintains accuracy across varying wafer and sheet thicknesses, reduces costs by eliminating the need for separate cutting and transferring devices, and detects defects in the cutting process.
Implementation Method 1
a press roller (14) for pressing the sheet to stick the same to the plate-like objects
Implementation Method 2
cutting means for cutting the sheet along the outer periphery of the plate-like object, wherein the cutting means is constituted of a multi-joint robot having a plurality of joints
Implementation Method 3
the multi-joint robot may adopt such an arrangement so as to be selectively mounted with a cutter blade and a suction arm to the free-end side thereof, and has a function to transfer the plate-like objects to the table when the suction arm is mounted
Data Source
AI summary
Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.