Robot Soldering Cell with Integrated Flux, Preheat, and Solder Supply
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Solution Overview
Problem
Conventional spot soldering devices require separate devices for flux application, preheating, and solder supply, leading to complex conveyor systems, potential component tilting, and increased device size due to separate process arrangements.
Innovation Solution
A robot apparatus with multiple joints, integrated flux ejection, preheating, and solder supply tools, and a controller for automated tool replacement and process control, allowing for simultaneous flux application, preheating, and solder supply without the need for extensive conveyor systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate devices are used for flux application, preheating, and solder supply, then each process can be performed independently, but the device size increases and conveyor systems become complicated
Solution Approach 1:
The patent combines the flux applying device, preheating device, and solder supplying device into a single integrated soldering device. The support member holds all three operation tools (flux ejection tool, preheating tool, and solder pot) in a clustered arrangement, allowing them to function together while reducing the overall device footprint and eliminating the need for separate conveyors between processes.
2Ease of manufacture
If separate devices are used for flux application, preheating, and solder supply, then each process can be performed independently, but the conveyor system becomes complicated
Solution Approach 1:
The patent merges multiple process devices into one integrated unit, which eliminates the need for complex conveyor systems that would be required to transport workpieces between separate flux applying, preheating, and soldering devices. The robot arm provides simple positioning within the integrated device.
3Ease of operation
If devices are arranged on the lower side with board moving above, then each process can be accessed, but the device size increases
Solution Approach 1:
The patent transitions from a horizontal arrangement where devices are placed side-by-side under the board to a vertical arrangement where multiple operation tools are stacked on a support member. This vertical stacking allows flux ejection, preheating, and solder supply to be performed in sequence from different heights, maintaining process accessibility while significantly reducing the horizontal footprint of the device.
4Ease of manufacture
If conventional separate devices are used, then each process can be performed, but components may fall over or tilt during conveyance
Solution Approach 1:
The patent combines all process steps into one integrated soldering device, eliminating the conveyance step between separate devices. The robot arm positions the workpiece directly within the integrated device for each operation, ensuring component stability throughout the entire soldering process without the risk of tilting or falling that occurs during transfers between separate devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The robot apparatus enables efficient, compact, and automated soldering operations by integrating all necessary processes, reducing the risk of component tilting and minimizing space requirements while maintaining precise control over the soldering process.
Implementation Method 1
a solder pot (7) having a container (71) for melting and storing solder
Implementation Method 2
flux is applied to a portion to be soldered so as to remove oxides and improve wettability
Implementation Method 3
arranging the solder pot below the workpiece so as to heat the workpiece by the heat released from the solder pot
Data Source
AI summary
The robot apparatus includes a solder pot having a nozzle from which solder flows out, a flux ejection tool for ejecting flux, and a support tool for supporting the solder pot. The robot apparatus includes a table for supporting a workpiece, and a placement member on which the operation tools and the solder pot can be placed. The controller performs a flux application control for coupling the flux ejection tool to the robot and applying flux to the workpiece, a preheating control for coupling the support tool to the robot and arranging the solder pot below the workpiece so as to heat the workpiece, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder.