Transfer Robot Teaching Buffer for Optical Wafer Hand Alignment
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Solution Overview
Problem
The existing substrate treating processes for semiconductor manufacturing are inefficient due to the time-consuming manual alignment of transfer robots, which affects productivity.
Innovation Solution
A substrate treating apparatus that includes a process chamber, a transfer robot with a robot hand for loading and unloading substrates, and a teaching buffer with a camera and teaching plate for automated alignment of the robot hand with reference points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual alignment method is used to align the robot hand with the substrate, then the alignment can be performed with simple equipment, but the alignment time is excessive and productivity is low
Solution Approach 1:
The patent replaces the manual mechanical alignment method with an automated optical alignment system. A camera captures images of alignment marks on the substrate and robot hand, and a control unit automatically calculates and adjusts the robot hand position based on image processing, eliminating time-consuming manual alignment operations.
Solution Approach 2:
The patent uses optical copying through camera imaging to create a digital representation of the physical alignment marks. The camera captures images of the substrate alignment mark and robot hand alignment mark, and the control unit processes these copied visual information to determine precise alignment without direct physical measurement.
2Measurement precision
If automated camera-based alignment is implemented, then alignment speed and precision are improved, but the device complexity increases due to additional components
Solution Approach 1:
The patent introduces alignment marks as intermediary elements that facilitate the alignment process. These marks are placed on both the substrate and robot hand, serving as visual mediators that the camera can detect and use to calculate precise alignment without requiring complex direct measurement systems.
Solution Approach 2:
The camera system serves multiple functions: it captures images of alignment marks, the control unit processes these images to determine both the position and orientation of the robot hand, and the system can be reused for different substrates and robot configurations, reducing the need for multiple specialized devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automated alignment process significantly improves the efficiency and productivity of substrate treatment by reducing manual alignment time and enhancing precision.
Implementation Method 1
at least one camera looking at the teaching plate, wherein the camera captures the reference point of the teaching plate
Data Source
AI summary
The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus of the present disclosure comprises a process chamber having a treating space therein, a transfer robot comprising a robot hand for loading and unloading a substrate into and out of the treating space and gripping the substrate, and a teaching buffer for aligning the robot hand, wherein the teaching buffer comprises a teaching plate for providing a reference point, and at least one camera looking at the teaching plate, wherein the camera captures the reference point of the teaching plate, wherein the transfer robot aligns the robot hand with the reference point using the camera.