Robotic Parcel Placement for 3D Void Space Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current logistics systems face inefficiencies in packing diverse, irregularly shaped parcels due to the 3D Bin Packing Problem, leading to significant void space in transport conveyances, which increases costs and environmental impact.

Innovation Solution

An automated system that uses advanced analytics and imaging to identify and position parcels optimally within conveyances, employing autonomous picking and placement models to minimize void space through intelligent conveyor systems, robotic arms, and gripper instruments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If manual or simple automated packing methods are used, then the packing process is simple to implement, but void space in transport conveyances increases significantly

Engineering Contradiction:
Improvepacking system complexityVSAvoidvoid space in conveyance
Core Design Contradiction:
Device complexityVSVolume of stationary object

Solution Approach 1:

The system performs preliminary analysis of parcel dimensions, shapes, and destinations using imaging devices and sensors before packing. The server system pre-calculates optimal packing arrangements and generates picking lists, allowing the actual packing process to execute efficiently without real-time decision-making complexity

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces manual mechanical packing operations with an automated system comprising imaging devices, sensor arrays, server-based optimization algorithms, and robotic picking/placing mechanisms. This substitution enables complex 3D bin packing optimization that would be impossible to achieve through simple mechanical means alone

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If advanced analytics and automated systems are used to minimize void space, then packing efficiency improves, but system complexity and initial costs increase

Engineering Contradiction:
Improvepacking efficiencyVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The packing system is divided into distinct functional modules: imaging devices for parcel characterization, sensor arrays for dimension verification, server systems for optimization calculation, and robotic execution units for picking and placing. This segmentation allows each component to be optimized independently and facilitates incremental implementation

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system employs autonomous algorithms that automatically analyze parcel data, determine optimal packing configurations, and control picking/placing operations without human intervention. The server system self-adjusts packing strategies based on real-time feedback from sensors and imaging devices, reducing the need for complex external control mechanisms

Inventive Principle:
Principle #25Self-service

3Adaptability or versatility

If parcels are packed manually, then flexibility in handling diverse shapes is maintained, but labor costs and time consumption increase

Engineering Contradiction:
Improvehandling flexibilityVSAvoidpacking time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The system uses imaging devices and sensors to capture multiple parameters of each parcel (dimensions, shape characteristics, weight, destination). The server system processes these parameters to dynamically adjust packing configurations, enabling automated adaptation to diverse parcel types while maintaining high speed

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The packing system dynamically adjusts its strategy based on real-time parcel characteristics. The server system continuously recalculates optimal arrangements as parcels are imaged and measured, allowing the system to adapt to varying shapes and sizes automatically without fixed rigid procedures

Inventive Principle:
Principle #15Dynamics

4Volume of stationary object

If more conveyances are used to compensate for void space, then cargo capacity is maintained, but transportation costs and environmental impact increase

Engineering Contradiction:
Improvecargo capacityVSAvoidtransportation energy consumption
Core Design Contradiction:
Volume of stationary objectVSLoss of energy

Solution Approach 1:

The system transitions from traditional 2D packing approaches to full 3D bin packing optimization. By utilizing vertical space and three-dimensional arrangements of parcels within conveyances, the system maximizes cargo capacity without requiring additional transportation vehicles, thereby reducing energy consumption and environmental impact

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240066711A1Systems, devices, and methods for performing optimized picking and placing operations in a manner to minimize void space
Publication Date: 2024.02.29 GRIDIRON ROBOTICS LLC
  • US20240066711A1 patent drawing
  • US20240066711A1 patent drawing
  • US20240066711A1 patent drawing

AI summary

Provided herein is a system for implementing a series of optimized picking and placing operations in a manner so as to minimize void space when packing a conveyance with parcels. The system may include one or more of an automated intelligent translation platform or motorized intelligent base member, an extendable and retractable injection platform, an automated positioning element that may be moveably coupled to the translation platform, base member, or injection platform, and an automated gripping instrument. One or more of the translation platform, intelligent base, and injection platform for moving the positioning element proximate a parcel to be picked and placed, and the gripper instrument for picking up the parcel for placement, in accordance with a generated placement model that minimized void space. A system server for generating the placement model may also be included.