Rocking Structure Differential Microphone for Atmospheric Pressure Resistance
Solution Overview
Problem
Miniature microphones face challenges in resisting deflection under atmospheric pressure while maintaining sensitivity to small sound pressures, and existing MEMS processing methods are not compatible with CMOS processes, limiting manufacturing options and fidelity.
Innovation Solution
A differential microphone design with sealed backside cavities and a rocking structure that rotates on a pivot, providing resistance to deflection and directional response, fabricated using MEMS surface micromachining without deep reactive ion etch, allowing for CMOS compatibility and vacuum sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a compliant membrane is used to detect small sound pressures, then sensitivity to sound pressure is improved, but the membrane collapses under atmospheric pressure
Solution Approach 1:
The microphone is divided into two separate backside sealed cavities instead of one large cavity, with each cavity supporting one diaphragm. This segmentation allows the atmospheric pressure to be distributed and managed independently in each cavity, preventing membrane collapse while maintaining sensitivity to small sound pressure variations.
Solution Approach 2:
The patent introduces a rocking structure that acts as a counterbalancing element. The rocking structure provides mechanical support and counteracts the atmospheric pressure force acting on the diaphragms, allowing the compliant membranes to maintain their shape and sensitivity without collapsing under external pressure.
2Ease of manufacture
If deep reactive ion etch is used in MEMS processing, then through-wafer cavity formation is achieved, but CMOS compatibility is lost
Solution Approach 1:
Instead of using a single deep reactive ion etch step through the entire wafer, the patent segments the cavity formation process into multiple shallower etching steps performed on opposite sides of the wafer. This approach achieves the same through-wafer cavity formation capability while using etch processes that are compatible with CMOS manufacturing, eliminating the need for non-compatible deep etching.
3Stability of the object's composition
If a stiff diaphragm is used to resist atmospheric pressure, then structural stability is improved, but sensitivity to small sound pressures deteriorates
Solution Approach 1:
The rocking structure serves as a mechanical counterweight that provides the necessary structural stability to resist atmospheric pressure. This allows the diaphragms to remain compliant and sensitive to small sound pressures without requiring the diaphragms themselves to be stiff, as the rocking structure bears the mechanical load of atmospheric pressure.
Solution Approach 2:
The rocking structure acts as an intermediary element between the atmospheric pressure and the diaphragms. It mediates the force transmission, allowing the diaphragms to remain compliant for sound detection while the rocking structure handles the mechanical stress of atmospheric pressure, thus resolving the contradiction between stiffness and sensitivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively resists collapse under atmospheric pressure and provides directional sensitivity to small sound pressures, enabling higher fidelity and cost-effective manufacturing through CMOS-compatible processes.
Implementation Method 1
a rocking structure coupled to the first and second diaphragms, where the rocking structure rotates on a pivot
Implementation Method 2
sealed backside cavities... providing resistance to deflection under external atmospheric pressure
Data Source
AI summary
A vacuum sealed directional microphone and methods for fabricating said vacuum sealed directional microphone. A vacuum sealed directional microphone includes a rocking structure coupled to two vacuum sealed diaphragms which are responsible for collecting incoming sound and deforming under sound pressure. The rocking structure's resistance to bending aids in reducing the deflection of each diaphragm under large atmospheric pressure. Furthermore, the rocking structure exhibits little resistance about its pivot thereby enabling it to freely rotate in response to small pressure gradients characteristic of sound. The backside cavities of such a device can be fabricated without the use of the deep reactive ion etch step thereby allowing such a microphone to be fabricated with a CMOS compatible process.


