Integrated RoF Optical Module Layout for Low-Loss RF Signal Paths
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Solution Overview
Problem
Conventional optical communication systems face challenges with insufficient internal space and high energy consumption, and RF circuitry connections via flexible circuit boards result in signal transmission loss and crosstalk due to long paths and mixed signal types, complicating manufacturing and increasing costs.
Innovation Solution
A RoF communication device integrates a RF circuit board and optical module within a hermetically sealed casing, with direct electrical connections to optical components, reducing signal transmission distance and crosstalk, and using a rigid board to simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If RF circuitry is connected to optical components via flexible circuit board, then design flexibility is enhanced, but signal transmission loss and crosstalk increase due to long transmission paths
Solution Approach 1:
The patent merges the RF circuit board and optical module into a single integrated unit, eliminating the need for separate flexible circuit board connections. The RF circuit board is directly mounted on the same substrate as the optical components, reducing the transmission path length and minimizing signal loss while maintaining design flexibility through the integrated layout.
2Adaptability or versatility
If RF circuitry is connected to optical components via flexible circuit board, then design flexibility is enhanced, but crosstalk increases due to mixed signal types on the same board
Solution Approach 1:
The patent combines RF and optical circuits on a single integrated substrate with dedicated signal paths. By merging the systems while providing separate transmission channels for different signal types, the design achieves flexibility without the crosstalk problems that would result from sharing common flexible circuit board pathways.
3Device complexity
If conventional optical communication systems are used, then existing infrastructure is maintained, but internal space is insufficient and energy consumption is high
Solution Approach 1:
The patent integrates multiple functional components (RF circuit board, optical transmitting unit, optical receiving unit, and control unit) into a single compact optical module. This consolidation reduces the overall device volume and eliminates the need for separate infrastructure components, thereby saving internal space while maintaining compatibility with existing optical communication infrastructure through standard optical interfaces.
4Device complexity
If conventional optical communication systems are used, then existing infrastructure is maintained, but energy consumption is high
Solution Approach 1:
The integrated design consolidates power management for RF and optical components into a unified system. By merging the RF circuit board and optical modules with shared power supply and control infrastructure, the system reduces redundant power consumption while maintaining compatibility with existing optical communication networks through standardized interfaces.
Data Source
AI summary
A RoF communication device includes a RF circuit board and an optical module. The optical module includes a casing, a connection circuit board, an optical transmitting unit and an optical receiving unit. The casing is connected with the RF circuit board. The connection circuit board is accommodated in the casing. The optical transmitting unit is mounted on the connection circuit board. The optical receiving unit is mounted on the connection circuit board. The electrical interface of the RF circuit board is provided in the casing, and the optical transmitting unit and the optical receiving unit are electrically connected with the electrical interface.